XC7VX690T-1FFG1926I

The XC7VX690T-1FFG1926I is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD, designed for high-density digital designs that require extensive logic, memory, and I/O resources. It combines a large pool of configurable logic with substantial on-chip RAM and a high I/O count to support complex system integration.

This device is targeted at designs that need significant integration and flexibility—providing 693,120 logic elements, approximately 54 Mbits of embedded memory, and 720 user I/O pins in a surface-mount FCBGA package. The part is rated for industrial operation and RoHS compliant.

Key Features

• Configurable Logic Blocks (CLBs) 54,150 CLBs delivering 693,120 logic elements for implementing large custom logic networks and high-density designs.
• Embedded Memory Approximately 54 Mbits of embedded memory (54,190,080 total RAM bits) to support on-chip data buffering, state storage, and compute acceleration.
• I/O Capacity 720 user I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and flexible signaling options.
• Power Supply Core voltage supply range from 0.970 V to 1.03 V to match system power rails and design requirements.
• Package & Mounting Available in 1924-BBGA (FCBGA) package; supplier device package listed as 1926-FCBGA (45×45). Surface-mount mounting type suited for compact PCB implementations.
• Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for extended environmental tolerance.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density digital systems Use the large logic capacity and CLB count to consolidate complex digital functions onto a single FPGA.
• I/O-intensive interfaces Take advantage of 720 I/O pins for multi-channel data acquisition, high-pin-count daughtercard interfaces, or parallel bus implementations.
• Industrial control and automation Leverage industrial temperature rating and robust on-chip resources to implement control logic, signal processing, and system integration in industrial equipment.
• Custom system integration Employ substantial embedded memory and logic elements to integrate multiple functions and reduce external component count.

Unique Advantages

• High logic capacity: 693,120 logic elements enable large-scale custom logic implementations without partitioning across multiple devices.
• Significant on-chip memory: Approximately 54 Mbits of embedded RAM supports data buffering, temporary storage, and state retention inside the FPGA.
• Extensive I/O availability: 720 I/O pins provide flexibility for dense interfacing and multi-channel connections.
• Industrial operating range: Rated from −40 °C to 100 °C for deployments in environments requiring extended temperature tolerance.
• FCBGA surface-mount package: 1924-BBGA / 1926-FCBGA (45×45) packaging supports compact PCB layouts and high-pin-count routing.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XC7VX690T-1FFG1926I?

The XC7VX690T-1FFG1926I positions itself as a high-density, industrial-grade FPGA option from AMD that brings together a very large logic fabric, substantial embedded memory, and a high I/O count in an FCBGA surface-mount package. These characteristics make it well suited to designs that require consolidation of complex digital functions, flexible interfacing, and reliable operation across extended temperature ranges.

For engineering teams and procurement focused on scalable, integration-friendly FPGA solutions, this device offers a measurable combination of logic resources, on-chip memory, and I/O capacity—backed by AMD as the manufacturer—making it a strong candidate for demanding industrial and high-density system designs.

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