XC7VX690T-1FFG1927I

IC FPGA 600 I/O 1927FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1924-BBGA, FCBGA

Quantity 532 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1927-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O600Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-1FFG1927I – Virtex®-7 XT FPGA, 1924‑BBGA (FCBGA), Industrial

The XC7VX690T-1FFG1927I is a high-density Virtex®-7 XT field programmable gate array designed for complex, resource-intensive digital designs. It delivers a large fabric of programmable logic, abundant embedded memory, and a high I/O count in a FCBGA package for surface-mount applications.

Targeted at industrial applications, this device combines approximately 693,120 logic elements, approximately 54 Mbits of embedded memory, and 600 I/O pins with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Key Features

  • Core Logic  Approximately 693,120 logic elements to support large-scale, parallel, and complex logic implementations.
  • Embedded Memory  Approximately 54 Mbits of on-chip RAM, enabling local buffering, lookup tables, and state storage without external memory for many functions.
  • I/O Capacity  600 I/O pins for high-density connectivity to peripherals, high-speed interfaces, and multi-channel systems.
  • Power Supply  Nominal core supply range from 970 mV to 1.03 V to match targeted FPGA core voltage requirements.
  • Package & Mounting  1924‑BBGA (FCBGA) package; supplier package listed as 1927‑FCBGA (45×45). Surface-mount mounting type suited for modern PCB assembly.
  • Operating Range  Industrial operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control & Automation  Use the device's industrial temperature range and large I/O complement for sensor aggregation, motor control logic, and factory-floor interfaces.
  • Telecommunications & Networking  High logic density and abundant I/O allow implementation of packet processing, protocol offload, and custom switching functions.
  • High‑Performance Signal Processing  Large logic and embedded memory resources support real-time DSP pipelines, FFT engines, and multi-channel data handling.
  • Data Acquisition & Aggregation  Combine many input channels and local buffering to consolidate and preprocess data streams before passing to host systems.

Unique Advantages

  • High Logic Capacity: The device’s approximately 693,120 logic elements enable implementation of complex, large-scale designs without segmenting across multiple FPGAs.
  • Substantial On‑Chip Memory: Approximately 54 Mbits of embedded RAM reduce dependence on external memory for many buffering and state-storage tasks.
  • Extensive I/O: 600 I/O pins provide the connectivity required for multi-channel systems, dense interface routing, and broad peripheral support.
  • Industrial Temperature Range: Specified −40 °C to 100 °C operation supports deployment in industrial and other temperature-challenging environments.
  • Compact Surface-Mount Package: FCBGA package options (1924‑BBGA / supplier 1927‑FCBGA 45×45) enable high-density PCB layouts and modern assembly processes.
  • RoHS Compliant: Meets RoHS requirements for lead-free manufacturing flows.

Why Choose XC7VX690T-1FFG1927I?

The XC7VX690T-1FFG1927I positions itself as a high-capacity, industrial-grade FPGA option for designs that require extensive logic resources, significant on-chip memory, and large I/O connectivity within a compact FCBGA package. Its combination of logic density, embedded RAM, and a wide operating temperature range makes it well suited for challenging embedded and industrial applications that demand both capacity and environmental resilience.

For engineers designing systems that need to consolidate functionality into a single programmable device—reducing board-level complexity and enabling scalable, high-performance implementations—this Virtex‑7 XT device provides the resources to realize complex, long-lived designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX690T-1FFG1927I.

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