XC7VX690T-1FFG1930C

IC FPGA 1000 I/O 1930FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 1000 54190080 693120 1924-BBGA, FCBGA

Quantity 1,057 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1930-FCBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1924-BBGA, FCBGANumber of I/O1000Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-1FFG1930C – Virtex®-7 XT FPGA, 1930-FCBGA

The XC7VX690T-1FFG1930C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) from AMD designed for high-density, configurable digital logic and embedded memory applications. With a large logic element count, substantial on-chip RAM, and a high I/O count, this device targets designs that require significant integration of logic, memory, and interface connectivity within a surface-mount FCBGA package.

Its specification set positions the device for systems that need substantial programmable resources and high pin-count connectivity while operating within a commercial temperature range and low-voltage core supply window.

Key Features

  • Core & Logic Capacity — 693,120 logic elements and 54,150 configurable logic blocks (CLBs) provide extensive programmable fabric for complex designs and large-scale integration.
  • On-chip Memory — Approximately 54 Mbits of embedded RAM (54,190,080 bits) to support memory-intensive algorithms, buffering, and on-chip data storage.
  • I/O Density — Up to 1,000 I/O pins to accommodate high-signal-count interfaces, multi-channel connectivity, and broad peripheral integration.
  • Package & Mounting — Supplier device package: 1930-FCBGA (45×45). Package case listed as 1924-BBGA, FCBGA. Designed for surface-mount assembly.
  • Power Supply — Core voltage range of 0.970 V to 1.030 V, enabling designs that align with the device’s low-voltage core requirements.
  • Temperature & Grade — Commercial grade operation from 0 °C to 85 °C for standard commercial applications and environments.
  • Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

  • High-density system design — Large programmable fabric supports complex logic implementations and system consolidation where thousands of logic elements are required.
  • Memory-intensive embedded processing — Approximately 54 Mbits of on-chip RAM makes the device suitable for buffering, packet processing, and other workloads that rely on embedded memory.
  • High I/O interface systems — Up to 1,000 I/O pins enable interfacing to many peripherals, multi-channel data acquisition, and high-bandwidth communication front-ends.

Unique Advantages

  • High logic density: 693,120 logic elements offer extensive programmable resources to implement large, integrated digital systems on a single FPGA.
  • Substantial embedded memory: Approximately 54 Mbits of on-chip RAM reduces external memory dependencies and improves data-path performance for memory-heavy designs.
  • Extensive I/O capability: 1,000 I/O pins simplify multi-interface designs and reduce the need for external multiplexing or expanders.
  • Surface-mount FCBGA packaging: 1930-FCBGA (45×45) supplier package supports high-pin-count board layouts and compact system integration.
  • Commercial temperature rating: Operation from 0 °C to 85 °C aligns with mainstream commercial deployments and standard electronic assemblies.
  • RoHS compliance: Enables use in lead-free manufacturing processes and supports regulatory requirements.

Why Choose XC7VX690T-1FFG1930C?

The XC7VX690T-1FFG1930C delivers a combination of high logic capacity, substantial embedded memory, and large I/O count within an FCBGA surface-mount package, making it well suited to designs that consolidate multiple functions into a single FPGA. Its specification set is tailored for engineers and procurement teams looking for a commercially graded Virtex‑7 family device with significant programmable resources.

For projects that demand scalable logic resources, on-chip memory for performance-sensitive paths, and broad connectivity, this Virtex‑7 XT device provides a robust platform to reduce external component count and simplify board-level integration.

Request a quote or submit a procurement inquiry to check pricing and availability for the XC7VX690T-1FFG1930C.

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