XC7VX690T-2FF1761C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 850 54190080 693120 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,315 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1761-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 850 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FF1761C – Virtex®-7 XT FPGA, 1760-BBGA (FCBGA)
The XC7VX690T-2FF1761C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) designed for applications that require a large logic capacity and extensive I/O. Its architecture provides a high count of logic elements and substantial on-chip RAM, making it suitable for complex, configurable digital designs.
This device is offered in a 1760-BBGA FCBGA package with surface-mount mounting and is specified for commercial-grade operation between 0 °C and 85 °C. It is RoHS compliant and operates with a core supply range of 970 mV to 1.03 V.
Key Features
- Logic Capacity — Provides 693,120 logic elements to implement large, highly parallel digital designs and complex custom logic.
- Embedded Memory — Approximately 54 Mbits of on-chip RAM (54,190,080 bits) for frame buffers, FIFOs, and data staging without external memory dependency.
- I/O Density — 850 user I/O pins to support wide bus interfaces, multi-lane links, and numerous peripheral connections.
- Power and Core Supply — Core voltage specified from 970 mV to 1.03 V to match system power rails and ensure correct device operation within the defined range.
- Package and Mounting — 1760-BBGA FCBGA package, supplier device package 1761-FCBGA (42.5×42.5), designed for surface-mount assembly in space-constrained board layouts.
- Operating Range and Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Data processing and acceleration: Large logic capacity and on-chip RAM enable custom compute pipelines and data staging for algorithm acceleration.
- High-density I/O systems: With 850 I/O pins, the device supports multi-interface integration and complex board-level interconnects.
- Prototyping and system integration: Flexible FPGA fabric and significant embedded memory support development and validation of complex digital subsystems.
Unique Advantages
- Substantial logic resources: 693,120 logic elements allow implementation of large-scale custom logic and parallel processing architectures.
- On-chip memory capacity: Approximately 54 Mbits of embedded RAM reduces reliance on external memory and simplifies board design.
- High I/O count: 850 I/O pins provide design flexibility for interfacing multiple peripherals, buses, and high-bandwidth links.
- Commercial-temperature rating: Specified operation from 0 °C to 85 °C for typical commercial applications.
- Surface-mount FCBGA packaging: 1760-BBGA package and 1761-FCBGA supplier package footprint (42.5×42.5) support compact, high-density PCB layouts.
- Regulatory compliance: RoHS compliance supports environmentally conscious product designs.
Why Choose XC7VX690T-2FF1761C?
The XC7VX690T-2FF1761C combines a very large logic element count with substantial on-chip RAM and a high I/O pin count to address designs that demand significant programmable logic and memory integration. Its FCBGA package and surface-mount form factor enable compact system integration while the specified core voltage range and commercial-temperature rating define clear system-level power and thermal requirements.
This device is well suited for engineering teams building complex digital subsystems that require scalability, extensive I/O connectivity, and embedded memory for data buffering and temporary storage. The Virtex®-7 family heritage and RoHS compliance provide an established platform for long-term development and deployment in commercial applications.
Request a quote or submit a procurement request to obtain pricing, lead-time, and availability for the XC7VX690T-2FF1761C.

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