XC7VX690T-2FFG1157C

The XC7VX690T-2FFG1157C is a Virtex®-7 XT field programmable gate array from AMD designed for high-density digital integration. It provides a large logic fabric and substantial on-chip memory in a FCBGA package suitable for surface-mount assembly.

With 600 user I/O, a broad supply voltage range and commercial-grade operating temperature, this device targets complex designs that require significant logic capacity and embedded memory within a compact package.

Key Features

• Core Logic 54,150 CLBs and approximately 693,120 logic elements provide extensive programmable logic resources for large-scale digital designs.
• Embedded Memory Approximately 54.19 Mbits of on-chip RAM (54,190,080 bits) supports data buffering, FIFOs and local storage without external memory.
• I/O 600 user I/O pins enable wide external connectivity for high-pin-count systems and complex interfacing.
• Power Core supply voltage range from 970 mV to 1.03 V to match system power rails and design constraints.
• Package 1156-BBGA, FCBGA package; supplier device package listed as 1157-FCBGA (35×35) for surface-mount PCB integration.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Complex digital systems — Use the large logic capacity and extensive I/O to implement dense FPGA-based control and processing architectures.
• Signal processing and data buffering — Approximately 54.19 Mbits of embedded RAM supports local data storage, buffering and streaming tasks.
• High-pin-count interfaces — 600 I/O pins enable integration with multi-channel front-ends, mezzanine cards or high-density connector systems.

Unique Advantages

• High logic integration: 54,150 CLBs and ~693,120 logic elements reduce the need for multi-device implementations by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 54.19 Mbits of embedded RAM enables local data processing and reduces dependence on external memory components.
• Extensive I/O count: 600 I/O pins simplify board-level routing for systems requiring many external connections.
• Surface-mount FCBGA package: 1156-BBGA/1157-FCBGA (35×35) packaging supports high-density PCB design and automated assembly workflows.
• Commercial operating range: Rated 0 °C to 85 °C to match typical commercial electronic product environments.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance in applicable regions.

Why Choose XC7VX690T-2FFG1157C?

The XC7VX690T-2FFG1157C positions itself as a high-density Virtex®-7 XT FPGA offering a balance of large logic resources, significant embedded memory and a high I/O count in a compact FCBGA package. It is well suited for engineers designing complex digital systems that require consolidation of logic and on-chip storage while maintaining a surface-mount form factor.

Its commercial operating range, defined supply voltage window and RoHS compliance make it appropriate for a wide range of commercial electronic applications where large programmable capacity and integration are primary requirements.

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