XC7VX690T-2FFG1157I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1156-BBGA, FCBGA |
|---|---|
| Quantity | 165 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1157-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FFG1157I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 I/Os, 54.19 Mbits RAM, 693,120 logic elements, 1156-BBGA/1157-FCBGA
The XC7VX690T-2FFG1157I is an AMD Virtex®-7 XT field programmable gate array supplied in high-density BGA/FCBGA packages. It combines 693,120 logic elements with approximately 54.19 Mbits of embedded memory and 600 I/Os to support large, complex programmable designs.
Designed for industrial-grade use, the device is available in surface-mount 1156-BBGA / 1157-FCBGA (35×35) packages, supports a core supply range of 0.97 V to 1.03 V, and an operating temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity — 693,120 logic elements to implement large-scale digital designs and complex programmable logic functions.
- Embedded Memory — Approximately 54.19 Mbits of on-chip RAM to support buffering, lookup tables, and data-intensive logic operations.
- I/O Resources — 600 general-purpose I/Os to interface with external devices, peripherals, and board-level interconnects.
- Package Options — Available in 1156-BBGA and 1157-FCBGA (35×35) surface-mount packages to match board-density and thermal requirements.
- Power Supply — Core voltage support from 0.97 V to 1.03 V for precise power domain planning.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- RoHS Compliance — Device is RoHS compliant, meeting common environmental and lead-free requirements.
Typical Applications
- High-density programmable logic — Implement large custom logic fabrics and system-level functions that require hundreds of thousands of logic elements and substantial embedded memory.
- Interface and I/O aggregation — Aggregate and manage numerous external signals using up to 600 I/Os for system integration on dense boards.
- Industrial systems — Deploy in industrial equipment that benefits from the device’s industrial temperature rating and rugged surface-mount package options.
Unique Advantages
- High logic integration: 693,120 logic elements reduce the need for multiple devices, simplifying system architecture.
- Significant on-chip memory: Approximately 54.19 Mbits of embedded RAM supports large buffers and state storage without external memory.
- Extensive I/O count: 600 I/Os provide flexible connectivity for complex board-level designs and multiple peripheral interfaces.
- Industrial temperature support: Rated −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
- Compact surface-mount packages: 1156-BBGA and 1157-FCBGA (35×35) options facilitate high-density PCB layouts.
- Controlled core supply range: 0.97 V to 1.03 V simplifies power-supply planning for system designers.
Why Choose XC7VX690T-2FFG1157I?
The XC7VX690T-2FFG1157I positions itself as a high-capacity, industrial-grade Virtex®-7 XT FPGA from AMD suitable for designs that require substantial logic resources, embedded memory, and a large number of I/Os. Its package and operating temperature range make it a practical choice for dense, board-level integration in industrial environments.
Engineers and procurement teams seeking a scalable, high-density programmable solution will find the device’s combination of logic elements, on-chip RAM, and I/O count valuable for reducing component count and consolidating system functionality.
Request a quote or submit an inquiry to receive pricing and availability for the XC7VX690T-2FFG1157I.

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