XC7VX690T-2FFG1926I

The XC7VX690T-2FFG1926I is a Virtex‑7 XT field programmable gate array (FPGA) IC from AMD designed for high-density, industrial applications. It combines a very large logic capacity with substantial on‑chip memory and high I/O count to address complex, integration‑focused designs.

Key device characteristics include 693,120 logic elements, approximately 54 Mbits of embedded memory, 720 I/O pins, an industrial operating range, and a compact FCBGA package—attributes that support designs requiring high logic density, significant local RAM, and extensive interfacing.

Key Features

• Logic Capacity  693,120 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 54 Mbits of on‑chip RAM (54,190,080 total RAM bits) for buffering, lookup tables, and local data storage.
• I/O Density  720 I/O pins to support extensive external interfacing and parallel connectivity.
• Package  1924‑BBGA, FCBGA package with supplier package reference 1926‑FCBGA (45 × 45 mm) for high‑density board integration.
• Power Supply Range  Core voltage supply specified from 0.970 V to 1.030 V to align power delivery design with device requirements.
• Industrial Grade & Temperature Range  Rated as Industrial with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High‑density signal processing  Use the device's large logic element count and on‑chip RAM to implement complex DSP pipelines, custom accelerators, and algorithm-heavy workloads.
• I/O‑intensive interface hubs  Leverage 720 I/O pins for designs that require extensive parallel or multi‑channel external connectivity and routing.
• Industrial control and instrumentation  Industrial grade rating and a −40 °C to 100 °C operating range support deployment in factory automation, test equipment, and industrial monitoring systems.

Unique Advantages

• Massive logic resources: The 693,120 logic elements enable very large FPGA designs without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 54 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• High I/O count: 720 I/O pins provide flexibility for complex interfacing and multi‑channel connectivity requirements.
• Industrial suitability: Industrial grade classification and a wide operating temperature range support demanding environmental requirements.
• Compact, high‑density package: The 1924‑BBGA/1926‑FCBGA package supports dense PCB layouts while providing the connectivity needed for large designs.
• Defined core voltage window: A supply range of 0.970 V to 1.030 V helps simplify power supply design and verification.

Why Choose XC7VX690T-2FFG1926I?

The XC7VX690T-2FFG1926I positions itself as a high‑capacity, industrial‑grade FPGA solution for engineers who require dense logic resources, significant on‑chip memory, and extensive I/O in a compact package. Its combination of logic elements, embedded RAM, and operating temperature range makes it suitable for designs that demand integration and reliability in challenging environments.

Backed by AMD manufacturing and RoHS compliance, this device is aimed at teams building complex digital systems—where scalability, predictable power requirements, and industrial robustness contribute to long‑term design value.

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