XC7VX690T-2FFG1926C

IC FPGA 720 I/O 1926FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 720 54190080 693120 1924-BBGA, FCBGA

Quantity 350 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1926-FCBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1924-BBGA, FCBGANumber of I/O720Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-2FFG1926C – Virtex®-7 XT FPGA, 693,120 logic elements, 720 I/O

The XC7VX690T-2FFG1926C is a Virtex®-7 XT field programmable gate array (FPGA) from AMD designed for high-capacity digital designs. It combines a large logic fabric with substantial on-chip memory and a high I/O count to address complex, resource-intensive applications.

With 693,120 logic elements, approximately 54 Mbits of embedded memory, and 720 general-purpose I/O, this device is targeted at designs that require significant logic resources, abundant on-chip RAM, and extensive external connectivity while operating in standard commercial environments.

Key Features

  • Core Logic  Approximately 693,120 logic elements and 54,150 logic blocks (CLBs) provide extensive programmable fabric for large digital designs.
  • Embedded Memory  Approximately 54 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory for many functions.
  • I/O Capacity  720 general-purpose I/O pins to enable wide external connectivity and interface integration in systems with many peripherals or data lanes.
  • Power Domain  Core voltage supply range of 0.970 V to 1.03 V, specified for the device’s operating conditions.
  • Package & Mounting  1924-BBGA (FCBGA) package, supplier device package 1926-FCBGA (45×45), designed for surface-mount PCB assembly.
  • Operating Grade & Temperature  Commercial grade, specified for operation from 0 °C to 85 °C.
  • Regulatory  RoHS compliant for standard environmental and material requirements.

Typical Applications

  • High-capacity digital systems  Use the large logic count to implement complex custom logic, wide datapaths, and deep pipelined architectures.
  • On-chip memory–intensive designs  Leverage approximately 54 Mbits of embedded RAM for buffering, packet processing, or local data storage without immediate dependence on external DRAM.
  • Connectivity-heavy platforms  The 720 I/O pins support integration of many peripherals, multi-lane interfaces, and board-level I/O routing requirements.
  • Prototyping and system integration  Surface-mount FCBGA packaging and large programmable fabric make this device suitable for advanced prototyping and integration into commercial products.

Unique Advantages

  • Extensive programmable fabric: Nearly 693,120 logic elements enable implementation of large-scale custom logic and complex state machines within a single device.
  • Significant on-chip memory: Approximately 54 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path needs.
  • High I/O density: 720 I/O pins provide the headroom to interface multiple peripherals, parallel buses, or multi-lane connectivity without external expanders.
  • Commercial temperature rating: Specified for 0 °C to 85 °C operation for standard commercial deployment scenarios.
  • RoHS compliant and surface-mount ready: Meets material compliance expectations and is supplied in an FCBGA package suitable for automated PCB assembly.

Why Choose XC7VX690T-2FFG1926C?

The XC7VX690T-2FFG1926C delivers a balance of high logic capacity, substantial embedded memory, and broad I/O capability in a commercial-grade Virtex®-7 XT FPGA. Its combination of approximately 693,120 logic elements, roughly 54 Mbits of on-chip RAM, and 720 I/O pins positions it for complex designs that require integrated resources and extensive external connectivity.

Manufactured by AMD and supplied in a 1924-BBGA (FCBGA) package for surface-mount applications, this device is suited for engineering teams building large-scale, resource-intensive digital systems that demand a high level of on-chip integration within commercial temperature ranges.

Request a quote or submit an inquiry to get pricing and availability for the XC7VX690T-2FFG1926C and begin integrating this Virtex®-7 XT FPGA into your design workflow.

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