XC7VX690T-2FFG1930C

The XC7VX690T-2FFG1930C is a Virtex®-7 XT field programmable gate array (FPGA) offered in a high-density FCBGA package. It provides large logic capacity, substantial embedded memory, and a high pin count for complex, I/O‑heavy designs.

This device targets designs that require extensive on-chip resources and flexible I/O, supported by a surface-mount 1930‑FCBGA (45x45) package and commercial operating conditions.

Key Features

• Logic Capacity — 693,120 logic elements (cells) to implement large-scale digital designs and complex custom logic.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM (54,190,080 bits) for buffering, data storage, and fast local access.
• I/O Resources — 1,000 available I/O pins to support high pin-count interfaces and system integration.
• Package — Supplier device package: 1930‑FCBGA (45x45); package case listed as 1924‑BBGA, FCBGA, suitable for surface-mount assembly.
• Voltage Supply — Core voltage range from 970 mV to 1.03 V for device power rails and system planning.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliance — RoHS‑compliant device suitable for assemblies requiring lead‑free components.

Typical Applications

• High-density logic implementations — For systems that require hundreds of thousands of logic elements to implement complex state machines, protocol stacks, or custom accelerators.
• Memory‑intensive designs — Embedded applications that benefit from tens of megabits of on‑chip RAM for buffering, packet storage, or scratchpad memory.
• High‑pin‑count integration — Designs needing extensive external connectivity, leveraging the 1,000 I/O pins for multiple parallel interfaces and peripheral connections.

Unique Advantages

• Large on‑chip logic capacity: 693,120 logic elements enable implementation of extensive custom logic without external ASICs or multiple FPGAs.
• Substantial embedded memory: Approximately 54 Mbits of RAM reduces reliance on external memory for many buffering and caching tasks.
• Extensive I/O capability: 1,000 I/O pins simplify integration of multiple high‑speed or parallel interfaces.
• High‑density FCBGA packaging: 1930‑FCBGA (45x45) supports compact board layouts while delivering high pin counts for system integration.
• Commercial temperature and RoHS compliance: Suitable for standard commercial environments and lead‑free manufacturing flows.
• Well‑defined supply range: Core voltage range (970 mV to 1.03 V) assists in power delivery design and margin planning.

Why Choose XC7VX690T-2FFG1930C?

The XC7VX690T-2FFG1930C combines very large logic capacity, significant embedded memory, and a high I/O count in a surface-mount FCBGA package, making it a strong choice for complex digital designs that require on‑chip resources and dense external connectivity. Its commercial temperature range and RoHS compliance align with mainstream product and prototyping requirements.

This device is suited to engineering teams and projects that need scalable logic, abundant on‑chip RAM, and extensive I/O integration while maintaining clear power-supply requirements and compact board implementation via a 1930‑FCBGA (45x45) package.

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