XC7VX690T-3FFG1158E

The XC7VX690T-3FFG1158E is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD. It delivers a high logic element count and substantial on-chip memory targeted at complex, high-density programmable logic designs.

With 693,120 logic elements, approximately 54 Mbits of embedded memory and 350 I/O, this device is intended for applications that require large FPGA fabric, significant embedded RAM, and broad external connectivity while operating within an extended temperature range.

Key Features

• Logic Capacity — 693,120 logic elements provide a large programmable fabric for implementing complex digital designs.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive algorithms.
• High I/O Count — 350 user I/O pins to accommodate extensive external connectivity and interface requirements.
• Power and Core Voltage — Core supply range specified at 0.97 V to 1.03 V to match system power-rail planning.
• Package and Mounting — Package case listed as 1156-BBGA, FCBGA with supplier device package 1158-FCBGA (35×35); surface-mount mounting type.
• Temperature and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for a broad set of environmental conditions.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale programmable logic and custom hardware acceleration using the extensive logic element count.
• Memory-intensive processing — Leverage approximately 54 Mbits of embedded RAM for buffering, packet storage, or streaming data processing.
• I/O-heavy interfaces — Use 350 I/O pins to connect to multiple peripherals, high-speed transceivers, or external memory interfaces.
• System prototyping and integration — Suitable for developers who require significant FPGA resources and flexible packaging for board-level designs.

Unique Advantages

• Highly integrated logic and memory: 693,120 logic elements combined with ~54 Mbits of embedded RAM reduce the need for external logic and memory components.
• Broad external connectivity: 350 I/O pins enable dense peripheral and interface integration without extensive multiplexing.
• Design-level power targeting: Core voltage range of 0.97–1.03 V supports precise power-rail planning for power-sensitive designs.
• Flexible packaging: Available in BBGA/FCBGA package formats and a supplier device package footprint (1158-FCBGA 35×35) to fit various board layouts.
• Extended operating range: Extended grade and 0 °C–100 °C operating temperature accommodate a wide set of deployment environments.
• RoHS compliant: Meets RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose XC7VX690T-3FFG1158E?

The XC7VX690T-3FFG1158E positions itself as a high-capacity programmable logic device that combines a large logic fabric, substantial embedded RAM, and a high I/O count to address demanding FPGA-based designs. Its package options and surface-mount form factor make it suitable for board-level integration where density and connectivity are priorities.

Engineers and procurement teams seeking scalable FPGA resources with clear electrical and thermal parameters—0.97–1.03 V core supply and 0 °C–100 °C operating range—will find this device aligned with designs that require significant on-chip resources and RoHS compliance.

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