XC7VX690T-3FFG1930E

The XC7VX690T-3FFG1930E is a Virtex®-7 XT Field Programmable Gate Array from AMD, provided in a ball-grid FCBGA package. It delivers a very large logic capacity alongside high I/O density and substantial on-chip memory for complex, highly integrated designs.

This device is well suited to applications that require a combination of extensive programmable logic, approximately 54 Mbits of embedded memory, and up to 1,000 external I/Os, all in a surface-mount FCBGA package with an extended operating grade.

Key Features

• Logic Capacity — Provides 693,120 logic elements to implement large-scale digital designs and complex FPGA architectures.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM for buffering, data storage, and state-machine implementation without requiring external memory.
• I/O Density — Up to 1,000 I/Os to support wide data buses, multi-protocol interfaces, and extensive peripheral connectivity.
• Power Supply Range — Core voltage supply range from 970 mV to 1.03 V to match system power architectures and regulator selections.
• Package and Mounting — Available in 1924-BBGA / FCBGA package; supplier device package listed as 1930-FCBGA (45×45); designed for surface-mount assembly.
• Operating Grade and Temperature — Extended grade device with an operating temperature range of 0 °C to 100 °C for a variety of commercial and extended-temperature applications.
• Environment — RoHS compliant to meet standard environmental requirements for lead-free manufacturing.

Typical Applications

• High-density digital systems — Implement complex state machines, large finite-state logic, and system-level functions using the device’s 693,120 logic elements.
• Data buffering and memory-intensive tasks — Use the approximately 54 Mbits of embedded memory for packet buffering, data staging, and on-chip caching.
• Multi-interface connectivity — Leverage up to 1,000 I/Os for wide parallel buses, multiple serial interfaces, or extensive sensor and peripheral interfacing.

Unique Advantages

• Extensive on-chip resources: High logic element count and substantial embedded memory reduce dependence on external components and simplify board-level design.
• High I/O capacity: Up to 1,000 I/Os enable dense peripheral integration and flexible I/O routing for complex systems.
• Compact FCBGA packaging: FCBGA package options provide a high-pin-count solution in a surface-mount form factor suitable for space-constrained layouts.
• Precisely defined power requirements: A narrow core voltage supply range (970 mV–1.03 V) allows predictable power budgeting and regulator selection.
• Extended operating grade: Rated for 0 °C to 100 °C operation to support designs requiring broader-than-commercial temperature tolerance.
• RoHS compliant: Meets lead-free manufacturing requirements for environmentally conscious production.

Why Choose XC7VX690T-3FFG1930E?

The XC7VX690T-3FFG1930E balances very large programmable logic capacity, substantial embedded memory, and high I/O count in a surface-mount FCBGA package, making it a strong fit for demanding digital systems that consolidate multiple functions into a single FPGA. Its defined power and thermal characteristics, along with extended-grade operation, make it appropriate for designs that require predictable electrical and environmental behavior.

This Virtex®-7 XT device is intended for teams and projects that need to reduce board-level complexity through on-chip integration while maintaining flexibility to implement custom logic, buffering, and extensive interfacing without adding external components.

Request a quote or submit a parts inquiry to get pricing, availability, and lead-time information for the XC7VX690T-3FFG1930E. Our team can assist with ordering and part allocation for your design needs.