XC7VX690T-L2FFG1158E
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,869 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1158-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 350 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-L2FFG1158E – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA
The XC7VX690T-L2FFG1158E is a Virtex®-7 XT field programmable gate array (FPGA) designed to deliver large-scale, on-chip programmable logic and memory for complex digital designs. It combines hundreds of thousands of logic elements with tens of megabits of embedded RAM and a high-density I/O footprint to support systems that require substantial logic capacity and on-chip storage.
This device targets applications and development efforts that need high logic density, significant embedded memory, and a large number of I/O in a surface-mount FCBGA package, while operating within a defined core voltage and temperature range.
Key Features
- Logic Capacity Provides 693,120 logic elements to implement large-scale, complex digital designs and custom hardware functions.
- Embedded Memory Includes approximately 54 Mbits of on-chip RAM (54,190,080 total RAM bits) for data buffering, state storage, and lookup tables.
- I/O Density Features 350 I/O pins to support multiple external interfaces and high-pin-count system interconnects.
- Power Domains Core voltage supply range from 970 mV to 1.03 V, allowing precise power-supply design for the FPGA core.
- Package & Mounting Packaged in 1156-BBGA, FCBGA format with supplier device package listed as 1158-FCBGA (35×35). Surface mount mounting type supports board-level integration.
- Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for use in temperature-controlled environments.
- Environmental Compliance RoHS compliant, supporting regulatory requirements for lead-free designs.
Typical Applications
- High-density digital systems Used where large programmable logic capacity and substantial embedded RAM are required to implement custom processing pipelines and control logic.
- Interface aggregation Supports designs that require many external connections and signal routing thanks to its 350 I/O pins.
- Prototyping and complex system integration Suitable for development platforms and integration tasks that need a surface-mount, high-pin-count FPGA with extensive on-chip resources.
Unique Advantages
- High logic density: 693,120 logic elements enable implementation of large, complex digital functions without external ASICs.
- Significant embedded memory: Approximately 54 Mbits of on-chip RAM reduce reliance on external memory for many buffering and storage needs.
- Extensive I/O count: 350 I/O pins provide flexibility for multi-channel interfaces and complex board-level routing.
- Compact surface-mount FCBGA package: 1156-BBGA package and 1158-FCBGA (35×35) supplier package allow dense board placement and manufacturable PCB designs.
- Controlled core power requirement: Narrow core voltage range (970 mV to 1.03 V) facilitates precise power-supply design and integration.
- Regulatory compliance: RoHS compliance supports lead-free assembly and regulatory alignment.
Why Choose XC7VX690T-L2FFG1158E?
The XC7VX690T-L2FFG1158E positions itself as a high-capacity, surface-mount FPGA option that brings together a large number of logic elements, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its extended-grade temperature range and RoHS compliance make it appropriate for applications requiring controlled-environment operation and compliance with lead-free assembly requirements.
This device is suited for design teams and system integrators building complex digital systems that demand on-chip resources for logic and memory, dense I/O connectivity, and predictable core power specifications. Its combination of capacity and package options supports scalable designs and streamlined board-level integration.
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








