XC7VX690T-L2FFG1158E

IC FPGA 350 I/O 1158FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA

Quantity 1,869 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1158-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O350Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-L2FFG1158E – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA

The XC7VX690T-L2FFG1158E is a Virtex®-7 XT field programmable gate array (FPGA) designed to deliver large-scale, on-chip programmable logic and memory for complex digital designs. It combines hundreds of thousands of logic elements with tens of megabits of embedded RAM and a high-density I/O footprint to support systems that require substantial logic capacity and on-chip storage.

This device targets applications and development efforts that need high logic density, significant embedded memory, and a large number of I/O in a surface-mount FCBGA package, while operating within a defined core voltage and temperature range.

Key Features

  • Logic Capacity  Provides 693,120 logic elements to implement large-scale, complex digital designs and custom hardware functions.
  • Embedded Memory  Includes approximately 54 Mbits of on-chip RAM (54,190,080 total RAM bits) for data buffering, state storage, and lookup tables.
  • I/O Density  Features 350 I/O pins to support multiple external interfaces and high-pin-count system interconnects.
  • Power Domains  Core voltage supply range from 970 mV to 1.03 V, allowing precise power-supply design for the FPGA core.
  • Package & Mounting  Packaged in 1156-BBGA, FCBGA format with supplier device package listed as 1158-FCBGA (35×35). Surface mount mounting type supports board-level integration.
  • Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for use in temperature-controlled environments.
  • Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free designs.

Typical Applications

  • High-density digital systems  Used where large programmable logic capacity and substantial embedded RAM are required to implement custom processing pipelines and control logic.
  • Interface aggregation  Supports designs that require many external connections and signal routing thanks to its 350 I/O pins.
  • Prototyping and complex system integration  Suitable for development platforms and integration tasks that need a surface-mount, high-pin-count FPGA with extensive on-chip resources.

Unique Advantages

  • High logic density: 693,120 logic elements enable implementation of large, complex digital functions without external ASICs.
  • Significant embedded memory: Approximately 54 Mbits of on-chip RAM reduce reliance on external memory for many buffering and storage needs.
  • Extensive I/O count: 350 I/O pins provide flexibility for multi-channel interfaces and complex board-level routing.
  • Compact surface-mount FCBGA package: 1156-BBGA package and 1158-FCBGA (35×35) supplier package allow dense board placement and manufacturable PCB designs.
  • Controlled core power requirement: Narrow core voltage range (970 mV to 1.03 V) facilitates precise power-supply design and integration.
  • Regulatory compliance: RoHS compliance supports lead-free assembly and regulatory alignment.

Why Choose XC7VX690T-L2FFG1158E?

The XC7VX690T-L2FFG1158E positions itself as a high-capacity, surface-mount FPGA option that brings together a large number of logic elements, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its extended-grade temperature range and RoHS compliance make it appropriate for applications requiring controlled-environment operation and compliance with lead-free assembly requirements.

This device is suited for design teams and system integrators building complex digital systems that demand on-chip resources for logic and memory, dense I/O connectivity, and predictable core power specifications. Its combination of capacity and package options supports scalable designs and streamlined board-level integration.

Request a quote or submit an inquiry to receive pricing and availability for the XC7VX690T-L2FFG1158E.

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