XC7VX690T-L2FFG1761E
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 850 54190080 693120 1760-BBGA, FCBGA |
|---|---|
| Quantity | 674 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1761-FCBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 850 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-L2FFG1761E – Virtex®-7 XT Field Programmable Gate Array, 1760-BBGA
The XC7VX690T-L2FFG1761E is a Virtex®-7 XT field programmable gate array (FPGA) from AMD, supplied in a 1760-BBGA FCBGA package. It delivers very large logic and memory resources alongside a high I/O count for designs that require substantial on-chip capacity and connectivity.
Key on-chip resources include 693,120 logic elements, approximately 54.19 Mbits of embedded memory, and 850 I/O pins, combined with a supply voltage range of 970 mV to 1.03 V and an operating temperature range of 0 °C to 100 °C.
Key Features
- Core Logic 693,120 logic elements provide extensive programmable fabric for complex digital designs.
- Embedded Memory Approximately 54.19 Mbits of on-chip RAM for buffering, state storage, and data manipulation.
- I/O Capacity 850 user I/O pins to support dense external interfacing and high pin-count systems.
- Package 1760-BBGA FCBGA in a 1761-FCBGA supplier package with a 42.5 × 42.5 mm footprint for surface-mount board integration.
- Power Core supply voltage specified from 970 mV to 1.03 V for compatible power-rail design.
- Operating Range & Grade Extended-grade device rated for operation from 0 °C to 100 °C and RoHS compliant for environmental requirements.
- Mounting Surface-mount package suitable for automated PCB assembly flows.
Typical Applications
- High-density digital processing Large logic capacity and on-chip RAM support compute-intensive FPGA implementations and complex logic pipelines.
- High-pin-count interface systems 850 I/O pins enable integration with multi-channel data paths, measurement equipment, and high-bandwidth peripherals.
- System prototyping and integration Extensive programmable resources and a compact 42.5 × 42.5 mm FCBGA package suit advanced prototyping and subsystem integration.
Unique Advantages
- Substantial logic resources: 693,120 logic elements provide headroom for large FPGA designs and complex custom logic implementations.
- Significant embedded memory: Approximately 54.19 Mbits of on-chip RAM minimizes external memory dependencies for many buffering and storage tasks.
- High I/O density: 850 I/O pins simplify routing and reduce the need for external multiplexing in multi-channel systems.
- Compact FCBGA packaging: 1760-BBGA (1761-FCBGA, 42.5 × 42.5 mm) balances high integration with a manageable PCB footprint for surface-mount assembly.
- Extended-grade thermal range: Rated for 0 °C to 100 °C operation, suitable for designs targeting standard extended-temperature environments.
- Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose XC7VX690T-L2FFG1761E?
The XC7VX690T-L2FFG1761E positions itself as a high-capacity Virtex®-7 XT FPGA option for designs that need a combination of large programmable logic, substantial embedded memory, and extensive I/O. Its extended-grade rating, defined supply voltage window, and compact FCBGA package make it suitable for advanced system integration where on-chip resources and pin count are critical design drivers.
This device is appropriate for engineering teams building complex digital systems that benefit from scalable logic fabric, abundant on-chip RAM, and high connector density, while maintaining compliance with RoHS and standard extended operating temperatures.
Request a quote or submit an inquiry today to receive pricing and availability for the XC7VX690T-L2FFG1761E.

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