XC7VX980T-1FFG1926I
| Part Description |
Virtex-7 FPGA, XC7VX980T, 979,200 Logic Cells, 3600 DSP, FFG1926, Commercial |
|---|---|
| Quantity | 514 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FFG1926 | Grade | N/A | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1926-BGA | Number of I/O | 900 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 612000 | Number of Logic Elements/Cells | 979200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 55296000 |
Overview of XC7VX980T-1FFG1926I – Virtex®-7 XT FPGA, 979,200 logic elements, approximately 55 Mbits embedded RAM, 720 I/Os
The XC7VX980T-1FFG1926I is a Virtex®-7 XT field programmable gate array (FPGA) IC offering a high-density logic fabric and substantial on-chip memory. It combines 979,200 logic elements with approximately 55 Mbits of embedded RAM and 720 I/Os to address designs that require large-scale programmable logic and memory resources.
Packaged in a ball-grid FCBGA form factor and rated for industrial operation, this device targets applications that demand high integration density, a wide I/O complement, and defined power and thermal operating ranges.
Key Features
- Logic Capacity — 979,200 logic elements to support complex digital designs and large-scale implementation of custom logic functions.
- Embedded Memory — Total on-chip RAM of 55,296,000 bits (approximately 55 Mbits) for data buffering, FIFOs, and on-chip storage.
- I/O Count — 720 user I/Os to enable extensive interfacing and high-channel-count connectivity.
- Power Supply Range — Core voltage supply range from 970 mV to 1.03 V for defined power budgeting and design integration.
- Package and Mounting — Surface-mount FCBGA package; package case listed as 1924-BBGA and supplier device package 1926-FCBGA (45×45), suitable for high-density board layouts.
- Operating Range and Grade — Industrial grade device rated for operation from −40 °C to 100 °C, supporting wider temperature environments.
- Regulatory Compliance — RoHS compliant for environmental and assembly considerations.
Typical Applications
- High-density signal processing — Large logic capacity and significant embedded RAM enable implementation of complex signal-processing pipelines and buffering.
- Data aggregation and interfacing — High I/O count supports aggregation of multiple data streams and extensive peripheral interfacing.
- Prototyping large-scale FPGA designs — The combination of logic elements and on-chip memory provides a platform for developing and validating large custom hardware accelerators and control systems.
Unique Advantages
- Extensive programmable logic: 979,200 logic elements provide headroom for complex functions and parallel processing within a single device, reducing multi-chip partitioning.
- Significant embedded memory: Approximately 55 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage needs.
- High I/O density: 720 I/Os allow direct connection to a wide range of external devices and sensors, simplifying board-level design.
- Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in environments with wider thermal requirements.
- Compact FCBGA packaging: The 1924/1926 FCBGA packages (45×45) support dense PCB layouts while enabling surface-mount assembly processes.
- RoHS compliant: Meets lead-free manufacturing requirements for environmental and regulatory adherence.
Why Choose XC7VX980T-1FFG1926I?
The XC7VX980T-1FFG1926I positions itself as a high-capacity, industrial-grade FPGA suitable for designs requiring substantial logic, embedded memory, and a large number of I/Os. Its defined voltage range, industrial temperature rating, and compact FCBGA packaging make it a practical choice for engineers balancing integration density with environmental robustness.
This device is well suited for teams developing large-scale programmable logic solutions that benefit from on-chip memory and broad interfacing capability, offering a clear path for scalable system integration and long-term deployment.
Request a quote or submit a request for quotation to obtain pricing and availability for the XC7VX980T-1FFG1926I. Our team can provide lead-time and ordering information to support your project timelines.

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