XC7VX980T-1FFG1930I

The XC7VX980T-1FFG1930I is a Virtex®-7 XT field-programmable gate array (FPGA) manufactured by AMD. It delivers high logic capacity, substantial on-chip RAM, and a large I/O count in a BGA/FCBGA package targeted for industrial applications.

This device is suited for designs that require extensive programmable logic, significant embedded memory resources, and a wide operating temperature range, while supporting surface-mount assembly in high-density package formats.

Key Features

• Logic Capacity — Provides 979,200 logic elements for implementing complex digital designs and large-scale custom logic functions.
• On‑Chip Memory — Approximately 55.3 Mbits of embedded RAM (55,296,000 bits) to support data buffering, large lookup tables, and memory-intensive algorithms.
• I/O Density — 900 I/O pins to facilitate connectivity with multiple peripherals, external devices, and parallel interfaces.
• Package Options — Available in high-density ball grid formats (Package Case: 1924‑BBGA, FCBGA; Supplier Device Package: 1930‑FCBGA (45×45)) to optimize board area and routing.
• Power Supply Range — Core voltage range of 0.970 V to 1.03 V for the device supply domain.
• Operating Temperature — Industrial-grade temperature range from −40 °C to 100 °C for deployment in temperature-varied environments.
• Mounting and Compliance — Surface-mount device with RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

• Industrial Control and Automation — Use the large logic capacity and extended temperature range for control systems, programmable logic controllers, and industrial signal processing.
• High‑Density Data Processing — Leverage extensive on‑chip RAM and logic elements to implement data buffering, parallel processing, and custom compute blocks.
• I/O‑Intensive Systems — Employ the 900 I/O pins to interface with multiple sensors, actuators, and peripheral devices in complex systems.

Unique Advantages

• High Logic Integration: 979,200 logic elements allow substantial functional integration on a single device, reducing external component count.
• Large On‑Chip Memory: Approximately 55.3 Mbits of embedded RAM supports memory-hungry functions without relying on external memory.
• Extensive I/O Capacity: 900 I/Os provide flexibility for multi-channel interfaces and parallel connections, simplifying board-level design.
• Industrial Temperature Rating: −40 °C to 100 °C operation enables deployment in environments with wide temperature variation.
• Compact, High‑Density Packaging: FCBGA/BGA package formats (1930‑FCBGA and 1924‑BBGA) support high pin-count implementations in limited board area.
• RoHS Compliant: Conforms to environmental requirements for modern manufacturing processes.

Why Choose XC7VX980T-1FFG1930I?

The XC7VX980T-1FFG1930I positions itself as a high-capacity FPGA option for industrial designs that require large programmable logic resources, significant on‑chip memory, and abundant I/O in a compact BGA/FCBGA footprint. Its specified operating temperature range and RoHS compliance align with industrial manufacturing and deployment needs.

Manufactured by AMD, this Virtex‑7 XT device is appropriate for engineering teams focused on consolidating functionality, reducing board-level complexity, and scaling complex digital systems that demand substantial logic and memory resources.

Request a quote or submit an inquiry to get pricing and availability for the XC7VX980T-1FFG1930I.