XC7VX980T-1FFG1926C
| Part Description |
Virtex-7 FPGA, XC7VX980T, 979,200 Logic Cells, 3600 DSP, FFG1926, Commercial |
|---|---|
| Quantity | 809 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FFG1926 | Grade | N/A | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1926-BGA | Number of I/O | 900 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 612000 | Number of Logic Elements/Cells | 979200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 55296000 |
Overview of XC7VX980T-1FFG1926C – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 720 55296000 979200 1924-BBGA, FCBGA
The XC7VX980T-1FFG1926C is a Virtex®-7 XT field programmable gate array (FPGA) offered in a high-density FCBGA package for commercial applications. It combines a large logic fabric, substantial on-chip memory, and a broad I/O complement to support complex digital designs.
Designed for commercial-grade systems, this device delivers 979,200 logic elements, approximately 55.3 Mbits of embedded memory, and 720 I/O pins in a 1924-BBGA / 1926-FCBGA (45x45) footprint. Key electrical and environmental specs include a core supply range of 970 mV to 1.03 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 76,500 CLBs supporting 979,200 logic elements to implement large-scale digital designs and complex logic functions.
- Embedded Memory Approximately 55.3 Mbits of on-chip RAM bits for buffering, FIFOs, and local data storage.
- I/O Resources 720 I/O pins suitable for dense peripheral interfacing, bus bridging, and multi-channel connectivity.
- Package and Mounting Surface-mount FCBGA packaging: 1924-BBGA package case with supplier device package 1926-FCBGA (45x45) for high-pin-count board designs.
- Power Core voltage supply range of 970 mV to 1.03 V to match system power requirements.
- Operating Range & Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High-density digital systems Implement complex logic and control functions using the device's large logic element count and CLB resources.
- Memory-intensive designs Leverage approximately 55.3 Mbits of embedded memory for buffering, packet processing, and local data storage.
- High-I/O interfacing Use the 720 I/O pins for multi-channel interfaces, protocol bridging, and dense external device connectivity.
- Commercial embedded platforms Integrate into commercial electronic products requiring high logic density and broad I/O within a 0 °C to 85 °C operating range.
Unique Advantages
- Highly integrated logic and memory: The combination of 979,200 logic elements and approximately 55.3 Mbits of RAM reduces external component needs and simplifies board-level design.
- Extensive I/O capability: 720 I/O pins enable complex interfacing and high channel counts without adding external multiplexing logic.
- High pin-count FCBGA packaging: The 1924-BBGA/1926-FCBGA (45x45) package supports dense routing and large-scale system integrations.
- Commercial-grade operating range: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
- RoHS compliant: Meets RoHS requirements for environmental and regulatory considerations.
- Controlled core voltage range: Operates with a defined supply range (970 mV to 1.03 V) for predictable power integration.
Why Choose XC7VX980T-1FFG1926C?
The XC7VX980T-1FFG1926C is positioned for commercial designs that need a large logic fabric, substantial embedded memory, and a wide I/O complement in a high-pin-count FCBGA package. Its specification set supports projects where on-chip resources and dense interfacing reduce system complexity and component count.
This device is appropriate for engineering teams implementing complex digital functions, memory-heavy processing, or multi-channel interfacing within commercial temperature and power envelopes. Its combination of capacity, packaging, and compliance provides a clear option for scalable FPGA-based system designs.
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