XC7VX690T-L2FFG1926E

IC FPGA 720 I/O 1926FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 720 54190080 693120 1924-BBGA, FCBGA

Quantity 504 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1926-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O720Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-L2FFG1926E – Virtex®-7 XT Field Programmable Gate Array (FPGA)

The XC7VX690T-L2FFG1926E is a Virtex®-7 XT field programmable gate array offering a large logic and memory footprint for complex, programmable digital designs. It combines 693,120 logic elements (cells), approximately 54 Mbits of on-chip RAM, and up to 720 user I/Os in a high-pin-count FCBGA package.

Targeted at applications that require substantial programmable logic, high I/O density, and on-chip memory, this extended-grade, surface-mount FPGA provides a compact integration point for advanced communications, signal processing, and custom hardware acceleration designs.

Key Features

  • Logic Capacity — 693,120 logic elements (cells) to implement large-scale programmable logic functions and complex finite-state machines.
  • Embedded Memory — Total RAM of 54,190,080 bits (approximately 54 Mbits) for buffering, packet queues, and algorithm state storage.
  • I/O Density — Up to 720 user I/Os to support wide parallel interfaces, multi-channel front ends, and high-pin-count connectivity.
  • Power Supply — Core voltage supply range from 0.970 V to 1.03 V to match platform power delivery designs.
  • Package — Available in 1924-BBGA, FCBGA package; supplier device package listed as 1926-FCBGA (45×45), suitable for surface-mount PCB assembly.
  • Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for deployments within that thermal envelope.
  • Regulatory — RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

  • Telecommunications Infrastructure — Implement protocol processing, packet switching, and multi-channel interface aggregation using the device’s high logic and I/O resources.
  • Signal Processing & Acceleration — Use abundant logic elements and on-chip RAM for DSP pipelines, custom accelerators, and real-time data manipulation.
  • High-Density I/O Systems — Support multi-lane interfaces, camera arrays, or sensor farms with the device’s large number of user I/Os.
  • Prototyping & Custom Hardware — Build and iterate complex system-on-chip prototypes that require substantial programmable logic and embedded memory.

Unique Advantages

  • Large Programmable Fabric: 693,120 logic elements enable implementation of extensive custom logic without external ASICs, reducing BOM complexity.
  • Significant On-Chip Memory: Approximately 54 Mbits of embedded RAM minimizes external memory dependency for buffering and state storage.
  • High I/O Count: 720 I/Os facilitate broad connectivity and parallel data paths, simplifying board-level interface routing and integration.
  • Extended-Grade Operation: Rated for 0 °C to 100 °C operation to meet designs requiring extended commercial temperature capability.
  • Compact, High-Pin Package: 1924-BBGA / 1926-FCBGA (45×45) packaging concentrates pins and logic in a space-efficient form factor for dense PCB layouts.
  • RoHS Compliance: Conforms to lead-free manufacturing requirements to support modern assembly processes.

Why Choose XC7VX690T-L2FFG1926E?

The XC7VX690T-L2FFG1926E positions itself as a high-capacity, on-board programmable solution for designs that need substantial logic, embedded memory, and extensive I/O in a single device. Its extended-grade rating and controlled core voltage range make it suitable for systems engineered around those operating conditions.

This FPGA is well suited to engineering teams building communications equipment, signal processing accelerators, multi-channel I/O systems, and advanced prototypes where integration density and scalable programmable resources are priorities. Its combination of logic capacity, memory, and I/O helps reduce external components and streamlines system architecture.

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