XC7VX690T-3FFG1927E

IC FPGA 600 I/O 1927FCBGA
Part Description

Virtex-7 FPGA, XC7VX690T, 693,120 Logic Cells, 3600 DSP, FFG1927, Commercial

Quantity 274 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device PackageFFG1927GradeN/AOperating Temperature0°C – 100°C
Package / Case1927-BGANumber of I/O1000Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceCompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4Number of LABs/CLBs433200Number of Logic Elements/Cells693120
Number of GatesN/AECCNEAR99HTS Code8542.31.00.60
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-3FFG1927E – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1924-BBGA, FCBGA

The XC7VX690T-3FFG1927E is a Virtex®-7 XT field programmable gate array delivering very high logic capacity and extensive I/O in a surface-mount FCBGA package. It integrates a large number of logic elements and embedded memory to support complex, high-density designs.

With approximately 693,120 logic elements, around 54 Mbits of embedded memory and 600 user I/O, this device targets designs that require significant on-chip resources and high I/O density while operating from a 0.97–1.03 V core supply.

Key Features

  • Core Logic Capacity  Approximately 693,120 logic elements provide high programmable logic density for complex designs and large-scale custom logic implementations.
  • Configurable Logic Blocks (CLBs)  54,150 CLBs (as provided) enable structured logic partitioning and efficient mapping of large designs.
  • Embedded Memory  Approximately 54 Mbits of on-chip RAM offer substantial local storage for buffers, FIFOs and datapath staging without external memory dependency.
  • High I/O Count  600 user I/O pins support extensive external interfacing for large sensor arrays, high-speed I/O fabrics, and multi-channel data systems.
  • Package & Mounting  Available in a 1924-BBGA package (supplier device package: 1927-FCBGA, 45×45), optimized for surface-mount PCB assembly.
  • Power  Core supply range of 0.970 V to 1.03 V allows precise power planning for the FPGA core domain.
  • Operating Range & Grade  Extended grade operation from 0 °C to 100 °C targets demanding commercial and extended-temperature environments.
  • Environmental Compliance  RoHS-compliant to meet common environmental regulatory requirements.

Typical Applications

  • High-density FPGA designs  Large-scale programmable logic implementations that require hundreds of thousands of logic elements and substantial on-chip memory.
  • Multi-channel I/O systems  Designs demanding extensive external interfacing, such as multi-lane data aggregation or large sensor arrays, benefit from the 600 I/O pins.
  • Embedded memory–intensive functions  Applications that use sizeable on-chip RAM for buffering, packet processing or streaming data handling without immediate reliance on external memory.

Unique Advantages

  • High logic density:  Approximately 693,120 logic elements reduce the need for multiple FPGAs in complex designs, simplifying system architecture.
  • Substantial on-chip memory:  Around 54 Mbits of embedded RAM provides local storage for performance-sensitive datapaths and buffering.
  • Broad I/O capability:  600 user I/Os enable dense external connectivity, minimizing the need for external I/O expansion components.
  • Flexible packaging:  1924-BBGA / 1927-FCBGA surface-mount package supports compact board layouts and high-density PCB designs.
  • Controlled power domain:  A defined core voltage window (0.970–1.03 V) facilitates stable core supply design and power management.
  • Extended temperature grade:  Rated for 0 °C to 100 °C operation to meet extended commercial temperature requirements.

Why Choose XC7VX690T-3FFG1927E?

The XC7VX690T-3FFG1927E positions itself as a high-capacity Virtex®-7 XT FPGA option for designs that demand a large programmable fabric, extensive embedded memory and a high I/O count. Its combination of roughly 693,120 logic elements, approximately 54 Mbits of on-chip RAM and 600 I/Os delivers integration and scalability for complex digital systems.

This device is suited to customers and designs that prioritize on-chip resource density, tight I/O packaging and defined power and temperature envelopes, offering a scalable platform for sophisticated programmable logic implementations.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX690T-3FFG1927E.

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