XC7VX690T-3FFG1927E
| Part Description |
Virtex-7 FPGA, XC7VX690T, 693,120 Logic Cells, 3600 DSP, FFG1927, Commercial |
|---|---|
| Quantity | 274 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FFG1927 | Grade | N/A | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1927-BGA | Number of I/O | 1000 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 433200 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-3FFG1927E – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1924-BBGA, FCBGA
The XC7VX690T-3FFG1927E is a Virtex®-7 XT field programmable gate array delivering very high logic capacity and extensive I/O in a surface-mount FCBGA package. It integrates a large number of logic elements and embedded memory to support complex, high-density designs.
With approximately 693,120 logic elements, around 54 Mbits of embedded memory and 600 user I/O, this device targets designs that require significant on-chip resources and high I/O density while operating from a 0.97–1.03 V core supply.
Key Features
- Core Logic Capacity Approximately 693,120 logic elements provide high programmable logic density for complex designs and large-scale custom logic implementations.
- Configurable Logic Blocks (CLBs) 54,150 CLBs (as provided) enable structured logic partitioning and efficient mapping of large designs.
- Embedded Memory Approximately 54 Mbits of on-chip RAM offer substantial local storage for buffers, FIFOs and datapath staging without external memory dependency.
- High I/O Count 600 user I/O pins support extensive external interfacing for large sensor arrays, high-speed I/O fabrics, and multi-channel data systems.
- Package & Mounting Available in a 1924-BBGA package (supplier device package: 1927-FCBGA, 45×45), optimized for surface-mount PCB assembly.
- Power Core supply range of 0.970 V to 1.03 V allows precise power planning for the FPGA core domain.
- Operating Range & Grade Extended grade operation from 0 °C to 100 °C targets demanding commercial and extended-temperature environments.
- Environmental Compliance RoHS-compliant to meet common environmental regulatory requirements.
Typical Applications
- High-density FPGA designs Large-scale programmable logic implementations that require hundreds of thousands of logic elements and substantial on-chip memory.
- Multi-channel I/O systems Designs demanding extensive external interfacing, such as multi-lane data aggregation or large sensor arrays, benefit from the 600 I/O pins.
- Embedded memory–intensive functions Applications that use sizeable on-chip RAM for buffering, packet processing or streaming data handling without immediate reliance on external memory.
Unique Advantages
- High logic density: Approximately 693,120 logic elements reduce the need for multiple FPGAs in complex designs, simplifying system architecture.
- Substantial on-chip memory: Around 54 Mbits of embedded RAM provides local storage for performance-sensitive datapaths and buffering.
- Broad I/O capability: 600 user I/Os enable dense external connectivity, minimizing the need for external I/O expansion components.
- Flexible packaging: 1924-BBGA / 1927-FCBGA surface-mount package supports compact board layouts and high-density PCB designs.
- Controlled power domain: A defined core voltage window (0.970–1.03 V) facilitates stable core supply design and power management.
- Extended temperature grade: Rated for 0 °C to 100 °C operation to meet extended commercial temperature requirements.
Why Choose XC7VX690T-3FFG1927E?
The XC7VX690T-3FFG1927E positions itself as a high-capacity Virtex®-7 XT FPGA option for designs that demand a large programmable fabric, extensive embedded memory and a high I/O count. Its combination of roughly 693,120 logic elements, approximately 54 Mbits of on-chip RAM and 600 I/Os delivers integration and scalability for complex digital systems.
This device is suited to customers and designs that prioritize on-chip resource density, tight I/O packaging and defined power and temperature envelopes, offering a scalable platform for sophisticated programmable logic implementations.
Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX690T-3FFG1927E.

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