XC7VX690T-3FFG1761E

The XC7VX690T-3FFG1761E is a Virtex®-7 XT Field Programmable Gate Array (FPGA) providing very high programmable logic capacity and on-chip memory for complex designs. With 693,120 logic elements and approximately 54.19 Mbits of embedded memory, this device targets high-density programmable logic applications that require large I/O counts and significant local storage.

Packaged in a 1760-BBGA FCBGA format with surface-mount mounting and an extended operating grade, the device supports designs that must balance integration density, I/O capability, and defined supply and temperature ranges.

Key Features

• Logic Capacity — 693,120 logic elements to support large-scale, high-density programmable logic implementations.
• Embedded Memory — Approximately 54.19 Mbits of on-chip RAM for data buffering, state storage, and local memory-intensive functions.
• I/O Density — 850 user I/Os to accommodate wide interfaces, multi-channel connectivity, and extensive board-level routing.
• Power Supply Range — Core voltage supply specified from 970 mV to 1.03 V for defined power budgeting and system design.
• Package and Mounting — 1760-BBGA, FCBGA package (supplier device package: 1761-FCBGA, 42.5 × 42.5 mm) with surface-mount mounting for compact board integration.
• Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for a range of commercial and extended-temperature deployments.
• Regulatory Compliance — RoHS compliant, supporting environmentally conscious manufacturing and end products.

Typical Applications

• High-density data processing — Implement large-scale parallel processing and custom datapaths using the device's extensive logic and embedded memory.
• Multi-channel I/O systems — Support complex interfacing and aggregation tasks with up to 850 I/Os for broad connectivity needs.
• FPGA-based prototyping and development — Use the high logic element count and substantial on-chip RAM for system validation and hardware-in-the-loop implementations.

Unique Advantages

• High logic integration: 693,120 logic elements enable consolidation of large functional blocks onto a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 54.19 Mbits of embedded RAM reduces reliance on external memory, improving performance for local buffering and stateful processing.
• Extensive I/O capability: 850 I/Os provide flexibility for wide buses, multiple interfaces, and parallel channel designs.
• Compact package with robust mounting: 1760-BBGA/FCBGA package and surface-mount mounting allow dense PCB layouts while maintaining mechanical stability.
• Defined power and thermal envelope: Core supply range of 970 mV–1.03 V and extended-grade temperature operation (0 °C–100 °C) enable predictable system-level power and thermal planning.
• RoHS compliant: Facilitates integration into environmentally conscious manufacturing processes.

Why Choose XC7VX690T-3FFG1761E?

The XC7VX690T-3FFG1761E positions itself as a high-capacity FPGA solution for designers who require substantial programmable logic, large embedded memory, and broad I/O in a single, surface-mount FCBGA package. Its specifications make it well suited for complex FPGA-based systems where consolidation, local memory capacity, and predictable supply and thermal parameters are important.

Engineers and procurement teams looking to implement scalable, high-density digital logic or prototype advanced processing architectures will find this device a strong candidate due to its combination of logic elements, on-chip RAM, and I/O density, delivered in an extended-grade, RoHS-compliant package.

Request a quote or submit a sales inquiry to obtain pricing and availability for the XC7VX690T-3FFG1761E.