XC7VX690T-3FFG1157E

The XC7VX690T-3FFG1157E is a Virtex®-7 XT field programmable gate array (FPGA) from AMD that delivers very high logic and memory capacity in a 1156‑ball FCBGA package. With hundreds of thousands of logic elements, tens of megabits of on‑chip RAM and a large I/O complement, this device is suited to designs that require substantial programmable logic, embedded memory and extensive I/O.

Key Features

• FPGA Core 
  Virtex‑7 XT architecture provided by AMD in the XC7VX690T-3FFG1157E part variant.
• Logic Capacity 
  693,120 logic elements to implement large, complex logic networks and custom datapaths.
• Configurable Logic Blocks (CLBs) 
  54,150 configurable logic blocks (CLBs) for granular logic partitioning and design scaling.
• Embedded Memory 
  Approximately 54.19 Mbits of on‑chip RAM to support buffering, FIFOs, and on‑device storage.
• I/O Resources 
  600 I/O pins to support high‑pin‑count interfaces and parallel connections.
• Power and Supply 
  Core voltage supply range of 970 mV to 1.03 V for the device core.
• Package and Mounting 
  1156‑BBGA (FCBGA) package; supplier device package listed as 1157‑FCBGA (35×35). Surface mount device.
• Temperature Grade 
  Extended grade operation from 0 °C to 100 °C.
• RoHS Compliance 
  RoHS compliant material status for environmental compliance.

Typical Applications

• High‑density programmable logic systems 
  Use the large logic element count and CLB resources to implement complex finite state machines, custom processors or extensive control logic.
• On‑device buffering and memory‑intensive designs 
  Leverage approximately 54.19 Mbits of embedded RAM for packet buffering, FIFOs and intermediate data storage inside the FPGA fabric.
• I/O‑heavy systems 
  600 I/O pins enable integration with multiple external interfaces, parallel buses or large sensor arrays requiring substantial pin count.

Unique Advantages

• High logic density: 693,120 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing the need for external logic chips.
• Substantial embedded memory: Approximately 54.19 Mbits of on‑chip RAM enable local data storage and high‑throughput buffering without external memory in many use cases.
• Large I/O complement: 600 I/O pins support complex interfacing requirements and allow flexible partitioning between internal logic and external connectivity.
• Robust packaging options: 1156‑BBGA (FCBGA) packaging and supplier package details (1157‑FCBGA, 35×35) provide a high‑pin‑count, surface‑mount form factor for dense board layouts.
• Extended temperature range: Rated for operation from 0 °C to 100 °C to match a range of commercial and extended‑environment system requirements.
• Manufacturer support: Supplied by AMD as part of the Virtex‑7 family, enabling access to family documentation and product resources from the vendor.

Why Choose XC7VX690T-3FFG1157E?

The XC7VX690T-3FFG1157E combines very large logic and memory resources with an extensive I/O complement and a high‑ball‑count FCBGA package, positioning it for designs that require consolidation of complex digital functions and significant on‑chip data storage. Its extended temperature grade and RoHS compliance make it suitable for a broad set of commercial and extended‑environment applications.

This AMD Virtex‑7 XT device is ideal for engineering teams and procurement buyers looking for a single‑chip solution to implement large programmable designs with substantial buffering and I/O requirements while remaining within the specified core voltage and temperature ranges.

Request a quote or submit an inquiry to get pricing, availability and additional product support information for the XC7VX690T-3FFG1157E.