XC7VX980T-2FFG1926C

IC FPGA 720 I/O 1926FCBGA
Part Description

Virtex-7 FPGA, XC7VX980T, 979,200 Logic Cells, 3600 DSP, FFG1926, Commercial

Quantity 1,784 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device PackageFFG1926GradeN/AOperating Temperature0°C – 85°C
Package / Case1926-BGANumber of I/O900Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceCompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4Number of LABs/CLBs612000Number of Logic Elements/Cells979200
Number of GatesN/AECCNEAR99HTS Code8542.31.00.60
QualificationN/ATotal RAM Bits55296000

Overview of XC7VX980T-2FFG1926C – Virtex®-7 XT Field Programmable Gate Array (FPGA)

The XC7VX980T-2FFG1926C is a Virtex-7 XT field programmable gate array (FPGA) designed to deliver high logic capacity and extensive on-chip memory for complex digital designs. With a large complement of logic elements, abundant I/O and a compact FCBGA package, it is aimed at designs that require dense integration and significant local memory resources.

Key Features

  • Logic Capacity 979,200 logic elements provide substantial programmable fabric for complex logic, parallel processing, and large custom designs.
  • Embedded Memory Approximately 55.3 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory for many use cases.
  • I/O Density 720 user I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals in compact system designs.
  • Power Supply Core voltage range 0.970 V to 1.03 V to match system power design requirements and ensure correct device operation within specified limits.
  • Package and Mounting Available in a ball grid array package (1924-BBGA, FCBGA) with supplier device package listed as 1926-FCBGA (45×45), designed for surface-mount assembly.
  • Operating Range and Grade Commercial-grade device rated for operation from 0 °C to 85 °C, suitable for standard commercial and industrial-environment electronics (commercial grade specified).
  • Compliance RoHS compliant, aligning with lead-free and restricted substance directives for environmentally conscious manufacturing.

Typical Applications

  • High-density signal processing — Large logic capacity and on-chip RAM enable implementation of complex DSP pipelines and parallel compute tasks.
  • Communications and networking — Abundant I/O and programmable fabric support wide interface arrays and protocol processing for network infrastructure and aggregation functions.
  • System prototyping and integration — High logic element count and memory make the device suitable for integrating multiple subsystems during hardware development and proof-of-concept work.
  • High-pin-count interface control — 720 I/O pins accommodate extensive peripheral connectivity and board-level interfacing in compact packages.

Unique Advantages

  • High logic density: 979,200 logic elements allow consolidation of large designs into a single device, reducing interconnect complexity.
  • Substantial embedded memory: Approximately 55.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O capability: 720 I/O pins provide flexibility for parallel data paths and multiple interfaces without external multiplexing hardware.
  • Compact surface-mount packaging: FCBGA package options minimize board area while supporting high pin counts and thermal management in system assemblies.
  • Controlled core voltage window: 0.970–1.03 V specification supports predictable power design and integration with board-level power systems.
  • RoHS compliant: Facilitates lead-free manufacturing and regulatory compliance for commercial products.

Why Choose XC7VX980T-2FFG1926C?

The XC7VX980T-2FFG1926C positions itself as a high-capacity FPGA option that combines nearly one million logic elements with tens of megabits of embedded RAM and a large I/O count. These attributes make it well suited for designers who need to consolidate complex logic, heavy data buffering, and extensive interfacing into a single, surface-mount package.

For teams developing high-density digital systems, communications interfaces, or advanced prototyping platforms, this device delivers the resources required for scalable and robust hardware implementations within a commercial temperature range.

Request a quote or submit a purchase inquiry to get pricing and availability information for the XC7VX980T-2FFG1926C.

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