XC7VX980T-2FFG1926C
| Part Description |
Virtex-7 FPGA, XC7VX980T, 979,200 Logic Cells, 3600 DSP, FFG1926, Commercial |
|---|---|
| Quantity | 1,784 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FFG1926 | Grade | N/A | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1926-BGA | Number of I/O | 900 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 612000 | Number of Logic Elements/Cells | 979200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 55296000 |
Overview of XC7VX980T-2FFG1926C – Virtex®-7 XT Field Programmable Gate Array (FPGA)
The XC7VX980T-2FFG1926C is a Virtex-7 XT field programmable gate array (FPGA) designed to deliver high logic capacity and extensive on-chip memory for complex digital designs. With a large complement of logic elements, abundant I/O and a compact FCBGA package, it is aimed at designs that require dense integration and significant local memory resources.
Key Features
- Logic Capacity 979,200 logic elements provide substantial programmable fabric for complex logic, parallel processing, and large custom designs.
- Embedded Memory Approximately 55.3 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory for many use cases.
- I/O Density 720 user I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals in compact system designs.
- Power Supply Core voltage range 0.970 V to 1.03 V to match system power design requirements and ensure correct device operation within specified limits.
- Package and Mounting Available in a ball grid array package (1924-BBGA, FCBGA) with supplier device package listed as 1926-FCBGA (45×45), designed for surface-mount assembly.
- Operating Range and Grade Commercial-grade device rated for operation from 0 °C to 85 °C, suitable for standard commercial and industrial-environment electronics (commercial grade specified).
- Compliance RoHS compliant, aligning with lead-free and restricted substance directives for environmentally conscious manufacturing.
Typical Applications
- High-density signal processing — Large logic capacity and on-chip RAM enable implementation of complex DSP pipelines and parallel compute tasks.
- Communications and networking — Abundant I/O and programmable fabric support wide interface arrays and protocol processing for network infrastructure and aggregation functions.
- System prototyping and integration — High logic element count and memory make the device suitable for integrating multiple subsystems during hardware development and proof-of-concept work.
- High-pin-count interface control — 720 I/O pins accommodate extensive peripheral connectivity and board-level interfacing in compact packages.
Unique Advantages
- High logic density: 979,200 logic elements allow consolidation of large designs into a single device, reducing interconnect complexity.
- Substantial embedded memory: Approximately 55.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
- Extensive I/O capability: 720 I/O pins provide flexibility for parallel data paths and multiple interfaces without external multiplexing hardware.
- Compact surface-mount packaging: FCBGA package options minimize board area while supporting high pin counts and thermal management in system assemblies.
- Controlled core voltage window: 0.970–1.03 V specification supports predictable power design and integration with board-level power systems.
- RoHS compliant: Facilitates lead-free manufacturing and regulatory compliance for commercial products.
Why Choose XC7VX980T-2FFG1926C?
The XC7VX980T-2FFG1926C positions itself as a high-capacity FPGA option that combines nearly one million logic elements with tens of megabits of embedded RAM and a large I/O count. These attributes make it well suited for designers who need to consolidate complex logic, heavy data buffering, and extensive interfacing into a single, surface-mount package.
For teams developing high-density digital systems, communications interfaces, or advanced prototyping platforms, this device delivers the resources required for scalable and robust hardware implementations within a commercial temperature range.
Request a quote or submit a purchase inquiry to get pricing and availability information for the XC7VX980T-2FFG1926C.

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