XC7VX980T-L2FFG1930E
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 900 55296000 979200 1924-BBGA, FCBGA |
|---|---|
| Quantity | 561 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1930-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 900 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 76500 | Number of Logic Elements/Cells | 979200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296000 |
Overview of XC7VX980T-L2FFG1930E – Virtex®-7 XT Field Programmable Gate Array (FPGA)
The XC7VX980T-L2FFG1930E is a Virtex®-7 XT Field Programmable Gate Array from AMD. It provides large on-chip logic capacity with 979,200 logic elements, approximately 55.3 Mbits of embedded memory, and 900 user I/O pins for designs that require extensive programmable logic and connectivity.
Its surface-mount FCBGA package and extended-grade operating range make it suitable for systems that need a high-density, integrated programmable device with defined voltage and thermal operating limits.
Key Features
- Logic Capacity 979,200 logic elements to support complex programmable logic designs and large-scale integration within a single FPGA device.
- Embedded Memory Approximately 55.3 Mbits of on-chip RAM to store buffers, state machines, and other data structures without external memory.
- I/O Density 900 user I/O pins provide extensive external connectivity options for high-pin-count interfaces and system integration.
- Power Supply Range Core voltage supply specified from 0.970 V to 1.030 V for accurate power budgeting and supply design.
- Package and Mounting 1924-BBGA (FCBGA) package in a supplier device package of 1930-FCBGA (45×45), designed for surface-mount assembly in space-constrained boards.
- Operating Range and Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for environmental regulation alignment.
Unique Advantages
- Large-scale integration: 979,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
- On-chip memory capacity: Approximately 55.3 Mbits of embedded RAM reduces reliance on external memory and simplifies timing and layout challenges.
- High I/O count: 900 I/Os allow direct interfacing with numerous peripherals and high-pin-count subsystems without additional I/O expanders.
- Compact FCBGA packaging: 1924-BBGA / 1930-FCBGA (45×45) packages provide a high-density solution for constrained PCB footprints while supporting surface-mount assembly.
- Controlled power envelope: Defined core voltage range (0.970 V–1.030 V) supports consistent power‑supply design and integration.
- Extended-grade operation: Specified 0 °C to 100 °C operating range and RoHS compliance support a wide set of deployment environments and regulatory requirements.
Why Choose XC7VX980T-L2FFG1930E?
XC7VX980T-L2FFG1930E positions itself as a high-density, highly integrated FPGA option for designs that demand substantial programmable logic, embedded memory, and a large number of I/Os. The combination of 979,200 logic elements, approximately 55.3 Mbits of on-chip RAM, and 900 user I/Os enables consolidation of complex functions into a single device, simplifying system architecture and reducing component count.
With a surface-mount FCBGA package, a defined core voltage range, extended-grade operating temperature, and RoHS compliance, this FPGA is suited to development and production environments that require predictable electrical and thermal characteristics along with environmental compliance. It is appropriate for engineering teams focused on high-capacity programmable solutions that need scalability and integration in a single AMD Virtex®-7 XT device.
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