XCAU10P-1SBVB484E

The XCAU10P-1SBVB484E is an Artix® UltraScale+ field programmable gate array (FPGA) device delivered in a 484-ball FCBGA package. It provides a combination of logic capacity, embedded memory, and I/O density for FPGA-based designs.

This extended-grade FPGA offers approximately 96,250 logic elements, roughly 3.67 Mbits of embedded memory, and 204 user I/Os, making it suitable for designs that require significant on-chip resources within a compact surface-mount package.

Key Features

• Logic Capacity  Approximately 96,250 logic elements to implement complex combinational and sequential logic.
• Configurable Logic Blocks (CLBs)  5,500 CLBs for structured logic partitioning and resource allocation.
• Embedded Memory  Approximately 3.67 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Resources  204 user I/Os to support high pin-count interfacing and multiple parallel interfaces.
• Power Supply  Core voltage supply range of 825 mV to 876 mV for the device core domain.
• Package and Mounting  484-FCBGA (19×19) package in a surface-mount form factor for board-level assembly.
• Temperature and Grade  Extended-grade device with an operating temperature range of 0°C to 100°C.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Embedded Compute and Control  Leverage the device’s logic capacity and on-chip RAM to implement custom control logic and embedded processing pipelines.
• High-Density I/O Interfaces  Use the 204 I/Os for multi-channel data acquisition, parallel interfaces, and protocol bridging.
• Memory-Intensive Functions  Deploy the approximately 3.67 Mbits of embedded memory for buffering, packet queues, and local data storage.

Unique Advantages

• Substantial Logic Resources: Approximately 96,250 logic elements provide the capacity to implement complex logic and control functions on-chip.
• Generous On-Chip Memory: Approximately 3.67 Mbits of embedded RAM reduces dependence on external memory for many intermediate buffering tasks.
• High I/O Count: 204 user I/Os enable flexible interfacing and support for multiple parallel channels or peripherals.
• Compact Surface-Mount Package: 484-FCBGA (19×19) package offers a high-integrity solution for space-constrained board designs.
• Extended Temperature Grade: Rated for 0°C to 100°C operation to meet a range of environmental conditions expected in many commercial and industrial applications.
• Low-Voltage Core Domain: Core supply range of 825 mV to 876 mV aligns the device with modern low-voltage system designs.

Why Choose XCAU10P-1SBVB484E?

The XCAU10P-1SBVB484E positions itself as a high-capacity, on-chip resource-rich FPGA in a compact 484-FCBGA package. Its combination of roughly 96,250 logic elements, approximately 3.67 Mbits of embedded memory, and 204 I/Os makes it well-suited for designs that require significant programmable logic, local memory, and flexible interfacing while maintaining a surface-mount form factor.

With extended-grade temperature support and RoHS compliance, this device offers a balanced option for engineering teams seeking scalable FPGA resources, straightforward board-level integration, and long-term availability backed by AMD’s UltraScale+ family documentation.

Request a quote or submit your specifications to receive pricing and availability for the XCAU10P-1SBVB484E. Our team can help confirm fit for your design and provide lead-time information.