XCAU10P-1UBVA368E

The XCAU10P-1UBVA368E is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) from AMD. It combines a high count of logic resources with on‑chip memory and a compact BGA package to support configurable digital designs.

Key hardware attributes include approximately 96,250 logic elements, roughly 3.67 Mbits of embedded RAM, 128 I/O pins, a low-voltage core supply range (825 mV to 876 mV), and a surface-mount 368‑ball FCBGA (10.5×10.5) package. The device is specified for extended grading with an operating temperature range of 0 °C to 100 °C and is RoHS compliant.

Key Features

• Core Logic Approximately 96,250 logic elements provide substantial programmable fabric for custom digital functions and complex control logic.
• Embedded Memory Approximately 3.67 Mbits of on‑chip RAM for FIFOs, buffers, and state storage without external memory components.
• I/O Capacity 128 I/O pins offer a balance of external connectivity for peripherals, sensors, and interfaces.
• Power Low-voltage core supply range of 825 mV to 876 mV supports targeted power domains and design-level power budgeting.
• Package and Mounting 368‑ball WFBGA/FCBGA package in a 10.5×10.5 mm supplier device package footprint; surface-mount mounting type for compact board-level integration.
• Operating Range and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for commercial and extended-temperature applications.
• Environmental Compliance RoHS compliant to support regulatory and assembly requirements.

Unique Advantages

• High logic density: Offers approximately 96,250 logic elements to implement large or multiple concurrent hardware functions on a single device, reducing the need for multiple ICs.
• Integrated embedded RAM: Approximately 3.67 Mbits of on‑chip memory reduces reliance on external memory and simplifies board designs that need local storage and buffering.
• Compact, solderable package: 368‑ball FCBGA (10.5×10.5) surface-mount package enables high-density PCB layouts while maintaining robust solderability.
• Low-voltage core operation: Core supply between 825 mV and 876 mV supports designs targeting low-power core rails and careful power budgeting.
• Extended operating temperature: Rated from 0 °C to 100 °C to support applications requiring an extended commercial temperature envelope.
• RoHS compliance: Meets environmental solderability and assembly standards for modern electronics manufacturing.

Why Choose XCAU10P-1UBVA368E?

The XCAU10P-1UBVA368E positions itself as a configurable, mid-density Artix® UltraScale+ FPGA well suited to designs that need a combination of substantial logic capacity, embedded memory, and a moderate I/O count in a compact surface-mount package. Its low-voltage core and extended temperature grade make it appropriate for projects focused on power-aware implementations and extended commercial temperature operation.

Manufactured by AMD, this device provides the reprogrammability and on‑chip resources needed to consolidate functions, reduce BOM, and enable iterative development. It is a strong fit for teams seeking a scalable, board-level FPGA solution with clear hardware specifications for integration and procurement.

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