XCAU10P-2FFVB676I

The XCAU10P-2FFVB676I is an Artix® UltraScale+ field programmable gate array (FPGA) IC from AMD, supplied in a 676-ball FCBGA package (27×27). It provides a balance of programmable logic capacity, embedded memory, and I/O count for designs that require configurable digital logic in a compact surface-mount package.

Key on-device resources include approximately 96,250 logic elements, roughly 3.67 Mbits of embedded memory, and 228 I/O pins. The device is industrial grade with an operating temperature range of −40 °C to 100 °C and an operating core supply window of 825 mV to 876 mV.

Key Features

• Core Logic  96,250 logic elements and 5,500 configurable logic blocks (CLBs) provide significant on-chip programmable resources for custom digital functions.
• Embedded Memory  Approximately 3.67 Mbits of on-chip RAM to support buffering, local data storage, and state-machine needs without external memory.
• I/O Capacity  228 I/O pins enable extensive external interfacing and flexible board-level connectivity options.
• Package and Mounting  676-ball FCBGA package (676-BBGA / 676-FCBGA, 27×27) optimized for surface-mount assembly in space-constrained designs.
• Power Profile  Core supply range specified from 825 mV to 876 mV to match system power architectures that meet the device’s operating window.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for demanding thermal environments.
• Compliance  RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Industrial Control and Automation  Programmable logic and industrial temperature rating support control functions and custom processing in industrial systems.
• Custom Digital Processing  High logic element count and embedded RAM enable implementation of tailored data-paths, finite-state machines, and signal processing blocks.
• Board-Level I/O Aggregation  228 I/O pins allow integration of multiple interfaces and sensors directly to the FPGA for system consolidation.

Unique Advantages

• Substantial On-Chip Logic:  Approximately 96,250 logic elements provide the capacity to implement complex custom functions on a single device, reducing the need for external ASICs or multiple FPGAs.
• Integrated Memory Resources:  Around 3.67 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks, simplifying board design.
• Large I/O Count:  228 I/O pins enable broad external connectivity and flexible interface routing without additional multiplexing components.
• Industrial Temperature Range:  Operation from −40 °C to 100 °C supports deployment in thermally challenging environments.
• Compact, Surface-Mount Form Factor:  676-FCBGA (27×27) package allows high-density mounting and efficient PCB real estate utilization.
• Regulatory Compliance:  RoHS compliance aligns with common manufacturing and environmental requirements.

Why Choose XCAU10P-2FFVB676I?

The XCAU10P-2FFVB676I positions itself as a capable Artix® UltraScale+ FPGA option for designs that require substantial programmable logic, embedded memory, and a high number of I/O in a compact surface-mount package. Its industrial operating range and RoHS compliance make it suitable for long-life, temperature-challenged systems.

This device is appropriate for engineers and procurement teams seeking a single-chip programmable solution that balances logic capacity, on-chip RAM, and I/O density while fitting into standard PCB assembly flows. Backed by AMD’s UltraScale+ family heritage, it offers a platform-level resource set for scalable, robust designs.

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