XCAU10P-1UBVA368I

The XCAU10P-1UBVA368I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC from AMD designed for industrial-grade embedded applications. It integrates a high logic element count with on-chip memory and a 128‑pin I/O capability in a compact 368‑FCBGA package to support complex, programmable system designs.

With a specified operating range of -40 °C to 100 °C, RoHS compliance, and a defined supply voltage window, this device is intended for projects that require predictable electrical characteristics and broad temperature tolerance.

Key Features

• Core and Logic — Approximately 96,250 logic elements and about 5,500 CLBs provide substantial programmable logic capacity for complex functions and custom datapaths.
• Embedded Memory — Approximately 3.67 Mbits of on-chip RAM (3,670,016 bits) for buffering, lookup tables, and state storage within FPGA logic.
• I/O — 128 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package and Mounting — Available in a 368‑WFBGA / 368‑FCBGA package; supplier device package listed as 368‑FCBGA (10.5 × 10.5 mm), surface-mount for compact board designs.
• Power — Defined voltage supply range of 698 mV to 742 mV to guide power supply design and margining.
• Temperature and Grade — Industrial grade device with an operating temperature range of -40 °C to 100 °C for deployment in temperature‑challenging environments.
• Regulatory — RoHS compliant, supporting environmentally conscious manufacturing requirements.

Unique Advantages

• High logic density: A large pool of logic elements and CLBs enables implementation of complex algorithms and multiple concurrent functions on a single device, reducing BOM count.
• On-chip memory capacity: Nearly 3.67 Mbits of embedded RAM supports local buffering and state retention without external memory in many use cases.
• Ample I/O connectivity: 128 I/O pins facilitate direct interfacing to a variety of external devices and peripherals.
• Industrial temperature tolerance: Rated from -40 °C to 100 °C to meet temperature requirements for industrial deployments.
• Compact, surface-mount package: 368‑FCBGA (10.5 × 10.5 mm) package maximizes PCB density while providing a robust mounting option.
• Predictable power window: A defined supply voltage range simplifies power budgeting and margin planning for reliable operation.

Why Choose XCAU10P-1UBVA368I?

The XCAU10P-1UBVA368I offers a balanced combination of programmable logic capacity, embedded memory, and I/O resources in a compact, industrial‑grade package. Its defined electrical and thermal specifications make it suitable for engineering teams focused on dependable, scalable FPGA-based designs.

This device is well suited for developers and integrators seeking a high‑capacity Artix® UltraScale+ FPGA with on-chip memory and a compact footprint, providing long-term value through a combination of integration, thermal range, and RoHS compliance.

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