XCAU10P-2SBVB484E

The XCAU10P-2SBVB484E is an Artix® UltraScale+ field programmable gate array (FPGA) from AMD. It provides a high-density programmable logic fabric with embedded memory and a substantial I/O complement in a 484-ball FCBGA package.

Targeted at designs that require configurable logic, on-chip RAM, and a moderate-to-high I/O count, this device combines a 96,250‑logic‑element architecture with approximately 3.67 Mbits of embedded memory. The device ships in a 484‑WFBGA (484‑FCBGA, 19×19) package and is offered in an Extended grade.

Key Features

• Logic Capacity — 96,250 logic elements for configurable digital logic and complex combinational/sequential designs.
• Embedded Memory — Approximately 3.67 Mbits of on‑chip RAM to support buffering, FIFOs, and on‑chip data storage.
• I/O — 204 I/O pins to support multiple interfaces, parallel buses, or mixed-signal I/O requirements.
• Power/Voltage — Core supply range of 825 mV to 876 mV, enabling operation within the specified low-voltage range.
• Package — 484‑WFBGA / 484‑FCBGA (19×19) supplier device package, suitable for surface-mount PCB assembly.
• Mounting and Grade — Surface mount device offered in Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental — RoHS compliant for restricted substance requirements.

Typical Applications

• Logic‑intensive digital designs — Use the device where large amounts of programmable logic (96,250 logic elements) are required for custom digital functions.
• On‑chip buffering and data path control — Approximately 3.67 Mbits of embedded RAM supports internal buffering, FIFOs, and temporary data storage needs.
• I/O‑centric interface implementations — With 204 I/Os, the device suits designs that require multiple parallel or serial interfaces and external device connectivity.

Unique Advantages

• High logic density: 96,250 logic elements enable implementation of complex custom logic blocks without external ASICs.
• Substantial embedded memory: Approximately 3.67 Mbits of RAM reduces reliance on external memory for many buffering and data‑path tasks.
• Generous I/O count: 204 I/Os simplify integration with sensors, peripherals, and high‑pin‑count interfaces.
• Compact package: 484‑ball WFBGA/FCBGA (19×19) provides a high pin‑count footprint in a compact surface‑mount form factor.
• Extended grade temperature: Rated 0 °C to 100 °C to meet extended commercial temperature requirements.
• Low‑voltage core operation: 825–876 mV supply range supports designs targeting low core-voltage operation.

Why Choose XCAU10P-2SBVB484E?

The XCAU10P-2SBVB484E from AMD delivers a balance of high logic capacity, embedded memory, and extensive I/O in a compact 484‑ball FCBGA package. Its specification suite — including 96,250 logic elements, approximately 3.67 Mbits of on‑chip RAM, 204 I/Os, and an Extended grade temperature range — makes it suitable for complex programmable logic designs that need substantial on‑chip resources and flexible connectivity.

This device is appropriate for developers and system integrators seeking a programmable, high‑density FPGA from a leading manufacturer (AMD) for use in designs that require configurable logic, embedded RAM, and multiple external interfaces.

Request a quote or submit an inquiry for pricing and availability of the XCAU10P-2SBVB484E to move your design forward.