XCAU10P-L1FFVB676I

The XCAU10P-L1FFVB676I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 676-ball FCBGA package (27×27 mm). This industrial-grade FPGA integrates a substantial logic fabric and embedded memory with a 228-pin I/O count, making it suitable for industrial and high-density embedded designs that require reconfigurable logic and moderate on-chip RAM.

Key electrical and environmental characteristics include a core voltage supply range of 698 mV to 742 mV and an operating temperature range from −40 °C to 100 °C, supporting deployment in demanding temperature environments.

Key Features

• Logic Capacity  Approximately 96,250 logic elements to implement complex custom logic and state machines.
• Embedded Memory  Approximately 3.67 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Count  228 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Power  Core supply range of 698 mV to 742 mV, enabling operation within a defined low-voltage window.
• Package & Mounting  676-ball FCBGA package (27×27 mm) designed for surface-mount PCB assembly.
• Industrial Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory Compliance  RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• Industrial Automation  Suitable for control logic, sequencing, and custom processing where industrial temperature range and reconfigurability are required.
• Embedded Systems  Used in embedded platforms needing substantial logic capacity and on-chip RAM for protocol handling and data processing.
• High‑Density I/O Designs  Provides 228 I/Os for interfacing multiple peripherals, sensors, and external devices in compact systems.

Unique Advantages

• Substantial Logic Resources:  Approximately 96,250 logic elements give designers the headroom to implement complex custom functions on a single device.
• On‑Chip Memory:  About 3.67 Mbits of embedded RAM reduces dependency on external memory for buffering and local storage.
• Industrial Operating Range:  Rated from −40 °C to 100 °C for reliable operation in challenging temperature environments.
• Compact FCBGA Package:  676-ball, 27×27 mm FCBGA balances density and thermal performance for surface-mount applications.
• Defined Low‑Voltage Core Support:  Core supply specification (698 mV–742 mV) provides clear electrical requirements for power-supply design.
• RoHS Compliant:  Suitable for lead‑free manufacturing processes and common environmental compliance needs.

Why Choose XCAU10P-L1FFVB676I?

The XCAU10P-L1FFVB676I positions itself as a versatile industrial-grade FPGA option that combines a large logic element count, several megabits of embedded RAM, and a high I/O count in a compact 676-FCBGA package. Its specified core voltage window and broad operating temperature range make it a practical choice for designers building robust, reconfigurable systems for industrial and high-density embedded applications.

Backed by AMD as the manufacturer, this device is suited to teams that need scalable logic capacity, on-chip memory resources, and clear electrical and environmental specifications for long-term deployment and system integration.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and detailed purchasing information.