XCAU15P-1FFVB676I

The XCAU15P-1FFVB676I is an Artix® UltraScale+ field programmable gate array (FPGA) supplied in a 676-ball FCBGA package (27×27 mm). It provides a large programmable fabric with a substantial number of logic elements and embedded RAM bits in a surface-mount form factor.

Built to industrial-grade temperature specifications and RoHS compliant, this device is suitable for designs that require significant on-chip logic, multiple I/O signals, and embedded memory within a compact BGA footprint.

Key Features

• Logic Capacity  170,100 logic elements and 9,720 CLBs provide a sizable programmable fabric for complex logic and control implementations.
• Embedded Memory  Approximately 5.35 Mbits of total on-chip RAM for buffering, lookup tables, and other local storage needs.
• I/O Count  228 general-purpose I/O pins to support multi-channel interfaces and dense peripheral connectivity.
• Package and Mounting  676-BBGA (676-FCBGA, 27×27) surface-mount package for compact board-level integration and high pin density.
• Power  Specified core supply voltage range of 698 mV to 742 mV to match targeted power-domain requirements.
• Temperature and Grade  Industrial grade operation with an ambient operating temperature range of −40 °C to 100 °C.
• Regulatory Compliance  RoHS compliant material designation for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control  Control logic and sensor interfacing systems that benefit from industrial temperature range and a high logic count.
• Multi‑I/O Systems  Designs requiring dozens to hundreds of I/O lines—such as data aggregation, interface bridging, or signal routing—can leverage the 228 I/O pins.
• Embedded Memory‑Intensive Logic  Applications that use on‑chip RAM for buffering, state machines, or LUT-based storage will benefit from the approximately 5.35 Mbits of embedded memory.
• Compact Board Designs  Systems that need substantial programmable logic in a space-efficient surface-mount BGA package can use the 676-FCBGA footprint to save PCB area.

Unique Advantages

• High logic density: 170,100 logic elements enable implementation of sizable logic networks without immediate need for multiple devices.
• Integrated on‑chip memory: Approximately 5.35 Mbits of RAM reduces dependence on external memory for many control and buffering tasks.
• Extensive I/O: 228 I/O pins support complex interfacing and integration of multiple peripherals or channels.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments.
• Compact, high‑density package: 676-FCBGA (27×27) enables a small PCB footprint while maintaining high pin count.
• RoHS compliant: Meets common supply-chain material requirements for modern manufacturing.

Why Choose XCAU15P-1FFVB676I?

The XCAU15P-1FFVB676I combines a large programmable logic array, significant on‑chip RAM, and a high I/O count in a compact 676-FCBGA surface-mount package. Its industrial-grade temperature range and RoHS compliance make it suitable for designs that require reliable operation across a broad environmental range while maintaining regulatory material standards.

This device is well-suited for engineers and procurement teams looking for a single-FPGA solution that balances logic capacity, embedded memory, and I/O density for integration in space‑constrained, industrial applications.

Request a quote or submit an inquiry to obtain pricing and availability for the XCAU15P-1FFVB676I.