XCAU15P-1UBVA368I

The XCAU15P-1UBVA368I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 368-FCBGA package. It provides a high logic element count and embedded RAM capacity for dense, programmable logic implementations.

Key on-chip resources include approximately 170,100 logic elements and roughly 5.35 Mbits of embedded memory, with 128 user I/O pins. The device is specified for industrial-grade operation across a wide temperature range and is RoHS compliant.

Key Features

• Core Logic  Approximately 170,100 logic elements organized across 9,720 CLBs to support complex programmable logic designs.
• Embedded Memory  Approximately 5.35 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Capacity  128 general-purpose I/O pins to interface with peripherals and external logic.
• Power  Specified core voltage supply range from 698 mV to 742 mV for device operation.
• Package & Mounting  368-WFBGA (368-FCBGA) surface-mount package, supplier device package size 368-FCBGA (10.5 × 10.5 mm) for compact board integration.
• Operating Conditions  Industrial-grade device rated for operation from -40 °C to 100 °C.
• Compliance  RoHS compliant to support environmental regulatory requirements.

Typical Applications

• High-density digital processing  Use the large logic element count and on-chip RAM to implement complex custom digital logic and data-path processing.
• Embedded acceleration  Implement hardware accelerators or custom compute engines using the device’s logic and memory resources.
• Interface aggregation  Consolidate multiple peripheral or I/O functions into a single programmable device using 128 available I/Os.
• Industrial control systems  Deploy in designs requiring industrial temperature operation and a compact FCBGA footprint.

Unique Advantages

• High logic capacity: Approximately 170,100 logic elements enable substantial custom logic integration on-chip.
• Significant embedded memory: About 5.35 Mbits of on-chip RAM reduces dependence on external memory for many applications.
• Compact package: 368-FCBGA (10.5 × 10.5 mm) package balances device density with board-area efficiency.
• Industrial temperature range: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS compliant: Meets environmental regulatory expectations for lead-free designs.

Why Choose XCAU15P-1UBVA368I?

The XCAU15P-1UBVA368I is positioned for designs that require high logic density, substantial embedded RAM, and a compact FCBGA package while meeting industrial temperature requirements. Its combination of approximately 170,100 logic elements, roughly 5.35 Mbits of on-chip RAM, and 128 I/Os makes it well suited to engineers implementing complex programmable logic and embedded processing functions.

Packaged in a 368-FCBGA and supplied by AMD, the device provides a balance of integration and robustness for project designs that demand significant on-chip resources within a compact, surface-mount solution.

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