XCAU15P-1SBVB484I

The XCAU15P-1SBVB484I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) from AMD, supplied in a 484-BFBGA / 484-FCBGA (19×19) package. It provides a high-capacity programmable fabric with 170,100 logic elements and approximately 5.35 Mbits of embedded memory, targeted at industrial-grade applications requiring reprogrammable logic and on-chip memory in a compact surface-mount package.

With 204 user I/O pins, an industrial operating range (–40 °C to 100 °C), and a low nominal supply range, this device is specified for designs where logic density, embedded memory, and defined I/O counts are key selection criteria.

Key Features

• Logic Capacity  170,100 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 5.35 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Resources  204 general-purpose I/O pins to support multi-channel interfaces and board-level connectivity.
• Power Supply  Core voltage specified between 698 mV and 742 mV, enabling designs that target this low-voltage operating window.
• Package & Mounting  484-BFBGA / 484-FCBGA package (supplier device package: 484-FCBGA, 19×19) in a surface-mount form factor for compact board layouts.
• Operating Range  Industrial-grade operation across –40 °C to 100 °C for deployed systems in challenging ambient conditions.
• Regulatory  RoHS compliant, meeting standard lead-free requirements for modern electronics manufacturing.

Typical Applications

• Programmable logic systems  Use the FPGA fabric and large logic count to implement custom, reprogrammable digital functions and state machines.
• Memory-intensive embedded designs  Leverage approximately 5.35 Mbits of embedded RAM for buffering, packet queues, and local data storage.
• I/O-dense boards  Support multi-channel interfaces and board-level connectivity with 204 user I/O pins in a compact FCBGA package.

Unique Advantages

• High logic density: 170,100 logic elements allow consolidation of complex functions onto a single device, reducing BOM count.
• Substantial on‑chip memory: Approximately 5.35 Mbits of RAM helps minimize external memory needs and simplifies board design.
• Defined I/O count: 204 I/O pins provide predictable routing and interface planning for multi-channel systems.
• Industrial temperature capability: Specified operation from –40 °C to 100 °C supports deployments in temperature-challenging environments.
• Compact surface-mount package: 484-FCBGA (19×19) packaging enables high-density PCB implementations while maintaining robust pin count.
• RoHS compliant: Conforms to lead-free manufacturing requirements for regulated product lines.

Why Choose XCAU15P-1SBVB484I?

The XCAU15P-1SBVB484I combines a large programmable fabric (170,100 logic elements) with meaningful on-chip memory (approximately 5.35 Mbits) and 204 I/O pins in a single 484-FCBGA surface-mount package. Its industrial temperature rating (–40 °C to 100 °C) and RoHS compliance make it suitable for long-lived, production-grade electronic systems where density and reliable operation are required.

This device is well suited to engineering teams and procurement professionals designing systems that need significant logic integration, embedded memory, and a defined I/O footprint packaged for compact PCB layouts. The specified supply and package details allow designers to plan power delivery and board assembly around established device parameters.

Request a quote or contact sales to obtain pricing, availability, and ordering details for the XCAU15P-1SBVB484I.