XCAU15P-1SBVB484E

IC FPGA ARTIXUP 484BGA
Part Description

Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 5347738 170100 484-WFBGA, FCBGA

Quantity 1,435 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-WFBGA, FCBGANumber of I/O204Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs9720Number of Logic Elements/Cells170100
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5347738

Overview of XCAU15P-1SBVB484E – Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 5347738 170100 484-WFBGA, FCBGA

The XCAU15P-1SBVB484E is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) from AMD supplied in a 484‑WFBGA FCBGA package. It provides high logic capacity, substantial on‑chip memory, and a broad I/O count for mid‑to‑high complexity programmable logic designs. With extended grade and RoHS compliance, this device targets applications that require significant programmable resources together with controlled operating and power conditions.

Key Features

  • Logic resources — 170,100 logic elements, providing a large fabric for custom logic implementation.
  • Configurable logic blocks — 9,720 CLBs for structured logic partitioning and design organization.
  • Embedded memory — approximately 5.35 Mbits of on‑chip RAM (5,347,738 total RAM bits) to support buffering, state storage, and local data handling.
  • I/O capacity — 204 user I/O pins to interface with external peripherals and systems.
  • Power — specified core supply range of 825 mV to 876 mV for the device core.
  • Package and mounting — 484‑WFBGA, FCBGA package; supplier device package 484‑FCBGA (19x19); surface mount format for PCB integration.
  • Temperature and grade — extended grade with an operating temperature range of 0 °C to 100 °C.
  • Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 170,100 logic elements enable complex FPGA implementations without immediate need for larger devices.
  • Substantial embedded memory: Approximately 5.35 Mbits of on‑chip RAM supports local buffering and reduces dependence on external memory.
  • Flexible I/O: 204 I/O pins provide flexibility for multi‑lane interfaces and diverse peripheral connections.
  • Compact, industry-standard package: 484‑FCBGA (19x19) package balances board space and thermal footprint for surface mount assembly.
  • Controlled core voltage: Narrow supply range (825–876 mV) simplifies power delivery planning for the core domain.
  • Extended grade and RoHS compliance: Supports deployments requiring extended operating range and environmental compliance.

Why Choose XCAU15P-1SBVB484E?

The XCAU15P-1SBVB484E is positioned for designs that require a substantial amount of programmable logic, meaningful on‑chip memory, and a broad set of I/Os while maintaining an extended operating grade and RoHS compliance. Its combination of 170,100 logic elements, approximately 5.35 Mbits of embedded memory, and 204 I/Os makes it suitable for advanced FPGA-based implementations where integration and resource density matter.

Packaged in a 484‑WFBGA FCBGA (supplier 484‑FCBGA (19x19)) surface mount format and operating across a 0 °C to 100 °C range with a defined core supply window, this device offers a clear set of electrical, mechanical, and environmental parameters to support development and procurement decisions.

Request a quote or submit a request for pricing and availability to get component and sourcing information for the XCAU15P-1SBVB484E. Include quantity, delivery requirements, and any special handling or packaging needs.

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