XCAU15P-1FFVB676E

The XCAU15P-1FFVB676E is an Artix® UltraScale+ field programmable gate array (FPGA) in a 676-BBGA FCBGA package. It integrates a high count of logic elements with on-chip memory and a large number of I/O pins for complex digital designs.

Designed for embedded and board-level integration, this surface-mount FPGA offers approximately 170,100 logic elements, roughly 5.35 Mbits of embedded memory, 228 I/O, and an extended-grade operating range of 0 °C to 100 °C, with a core voltage supply range of 825 mV to 876 mV.

Key Features

• Core Logic Approximately 170,100 logic elements to implement complex digital functions and large-scale logic designs.
• Embedded Memory Approximately 5.35 Mbits of on-chip RAM for buffering, lookup tables, and data staging without external memory.
• High I/O Count 228 I/O pins to support multi-channel interfaces and dense board-level connectivity.
• Power Specified core voltage supply range of 825 mV to 876 mV for system power planning and regulator selection.
• Package & Mounting 676-BBGA, FCBGA package (supplier device package: 676-FCBGA (27x27)) with surface-mount mounting for compact PCB integration.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C for a variety of commercial and embedded environments.
• Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-density digital processing — Use the large logic-element count to implement complex state machines, datapaths, and custom accelerators.
• Memory-intensive functions — Leverage approximately 5.35 Mbits of embedded RAM for buffering, packet staging, and LUT-based storage.
• Multi-channel I/O bridging — 228 I/O pins enable aggregation and translation of multiple parallel or serial interfaces.
• Compact board-level integration — The 676-FCBGA surface-mount package (27x27) supports dense PCB layouts and space-constrained system designs.

Unique Advantages

• Highly integrated logic and memory: Combines ~170,100 logic elements with ~5.35 Mbits of on-chip RAM to reduce reliance on external components.
• Large I/O capacity: 228 I/O pins allow flexible connectivity for complex multi-channel systems and peripheral interfaces.
• Compact FCBGA packaging: 676-FCBGA (27x27) surface-mount package enables dense board layouts and streamlined assembly.
• Extended operating range: Rated for 0 °C to 100 °C and labeled Extended grade for reliable operation across common embedded environments.
• Regulatory compliance: RoHS compliant to meet environmental requirements in product builds.

Why Choose XCAU15P-1FFVB676E?

The XCAU15P-1FFVB676E positions itself as a high-density, on-board FPGA option within the Artix UltraScale+ family, combining substantial logic resources, embedded memory, and a high I/O count in a compact FCBGA package. Its extended-grade temperature range and RoHS compliance make it suitable for many embedded system designs that require integration and deterministic hardware resources.

This device is well suited to designers and teams implementing complex digital logic, memory-buffered data flows, or multi-interface bridging on space-constrained PCBs. The combination of logic capacity, embedded RAM, and packaging supports scalable designs that can leverage the broader UltraScale+ documentation and resources.

Request a quote or submit an inquiry to receive pricing and availability information for the XCAU15P-1FFVB676E. Our team can provide lead-time details and assistance to support your procurement and design planning.