XCAU10P-L1UBVA368I

IC FPGA ARTIXUP LP 368BGA
Part Description

Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 128 3670016 96250 368-WFBGA, FCBGA

Quantity 332 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package368-FCBGA (10.5x10.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case368-WFBGA, FCBGANumber of I/O128Voltage698 mV - 742 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5500Number of Logic Elements/Cells96250
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3670016

Overview of XCAU10P-L1UBVA368I – Artix® UltraScale+ FPGA, 128 I/Os, 96,250 logic elements, approximately 3.67 Mbits RAM, 368-FCBGA

The XCAU10P-L1UBVA368I is an Artix® UltraScale+ field programmable gate array (FPGA) from AMD, provided in a 368-FCBGA (10.5×10.5) surface-mount package. This industrial-grade FPGA consolidates logic, embedded memory, and I/O density into a compact package suitable for designs requiring reconfigurable digital logic under extended temperature conditions.

With 96,250 logic elements, approximately 3.67 Mbits of on-chip RAM, and 128 I/O pins, the device targets industrial applications that need configurable logic capacity, substantial embedded memory, and a robust operating temperature range.

Key Features

  • Core Logic  Provides 5,500 configurable logic blocks (CLBs) corresponding to 96,250 logic elements, enabling complex digital functions and custom architectures.
  • Embedded Memory  Approximately 3.67 Mbits of on-chip RAM for buffering, state storage, and data processing close to logic resources.
  • I/O Capacity  128 I/O pins to support a wide range of external interfaces and parallel connections in compact systems.
  • Power Supply  Operates from a specified supply range of 698 mV to 742 mV, allowing designers to plan power delivery and sequencing precisely.
  • Package & Mounting  Supplied in a 368-WFBGA / 368-FCBGA surface-mount package (368-FCBGA, 10.5×10.5), supporting dense board-level integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for thermally demanding or outdoor industrial environments.
  • Environmental Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control & Automation  Use the industrial-grade FPGA to implement custom control logic, deterministic processing, and interface aggregation in factory automation systems.
  • Embedded Instrumentation  Deploy for data acquisition, preprocessing, and deterministic signal handling where on-chip RAM and configurable logic improve latency and integration.
  • Communications & Networking (Industrial)  Support protocol handling and parallel I/O aggregation in industrial networking equipment requiring reconfigurable logic capacity.

Unique Advantages

  • High logic density: 96,250 logic elements provide substantial capacity for implementing large custom designs without external ASICs.
  • Significant on-chip memory: Approximately 3.67 Mbits of embedded RAM reduces dependence on external memory for buffering and local data processing.
  • Industrial robustness: Rated for −40 °C to 100 °C operation, enabling deployment in extended-temperature industrial environments.
  • Compact, board-ready package: The 368-FCBGA (10.5×10.5) surface-mount package enables dense, low-profile system designs.
  • Flexible I/O provisioning: 128 I/O pins support a variety of peripheral interfaces and parallel connections for system integration.
  • Regulatory readiness: RoHS compliance simplifies environmental qualification and manufacturing planning.

Why Choose XCAU10P-L1UBVA368I?

The XCAU10P-L1UBVA368I positions itself as a versatile, industrial-grade FPGA option that balances considerable logic capacity, useful on-chip memory, and a robust operating temperature range in a compact FCBGA package. Its specifications address the needs of engineers designing reconfigurable digital systems that require reliable operation in industrial environments.

This device is well suited for development teams and OEMs that need scalable FPGA resources, significant embedded RAM, and a disciplined power and thermal envelope for long-term deployments and iterative hardware updates.

Request a quote or submit an inquiry to receive pricing, availability, and support for integrating the XCAU10P-L1UBVA368I into your next design.

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