XCAU15P-1UBVA368E

The XCAU15P-1UBVA368E is an Artix® UltraScale+ field programmable gate array (FPGA) IC from AMD. This device provides 170,100 logic elements, approximately 5.35 Mbits of embedded memory, and 128 I/O in a 368-FCBGA package.

Designed for surface-mount assembly and rated as Extended grade, the device operates with a core supply range of 825 mV to 876 mV and an operating temperature range of 0 °C to 100 °C.

Key Features

• Core Logic — 170,100 logic elements for high-density programmable logic implementations.
• Embedded Memory — Approximately 5.35 Mbits of on-chip RAM to support local buffering, FIFOs, and memory-based logic functions.
• I/O — 128 I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Package — 368-WFBGA / 368-FCBGA mounting with supplier device package noted as 368-FCBGA (10.5x10.5) for compact board integration.
• Power — Core voltage supply specified between 825 mV and 876 mV to match low-voltage system designs.
• Temperature & Grade — Extended grade device rated for operation from 0 °C to 100 °C.
• Mounting & Compliance — Surface mount package and RoHS compliant.

Typical Applications

• System Prototyping and Development — Leverage the device’s large logic count and embedded memory to implement and iterate complex FPGA designs on a compact package.
• High-density Logic Implementations — Use the 170,100 logic elements for compute-heavy programmable logic tasks where on-chip resources are required.
• Memory-intensive Functions — Approximately 5.35 Mbits of embedded RAM supports local data buffering, packet processing, and FIFO requirements.
• I/O-rich Designs — 128 I/O enable multiple external interfaces and board-level connectivity in space-constrained layouts.

Unique Advantages

• High Logic Capacity: 170,100 logic elements permit dense implementation of complex logic and state machines.
• Substantial On-chip Memory: Approximately 5.35 Mbits of embedded RAM reduces dependence on external memory for many designs.
• Generous I/O Count: 128 I/O pins provide flexibility to connect peripherals and multiple interfaces without immediate external multiplexing.
• Compact, Surface-mount Package: 368-FCBGA packaging (368-WFBGA listed) enables high-density board layouts while supporting surface-mount assembly processes.
• Defined Power Envelope: Core supply range of 825 mV–876 mV facilitates integration into low-voltage power architectures.
• Extended Grade Reliability: Rated as Extended grade with an operating range of 0 °C–100 °C for applications requiring that temperature window.

Why Choose XCAU15P-1UBVA368E?

The XCAU15P-1UBVA368E delivers a combination of high logic density, significant embedded memory, and ample I/O in a compact surface-mount FCBGA package. Its defined core voltage and Extended grade operating range make it suitable for designs that require predictable electrical and thermal parameters.

This part is well suited for engineers and procurement teams looking for a scalable programmable-logic building block that consolidates logic, memory, and I/O on a single device while remaining RoHS compliant.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the XCAU15P-1UBVA368E.