XCAU15P-2FFVB676I

The XCAU15P-2FFVB676I is an Artix® UltraScale+ field programmable gate array (FPGA) from AMD. It provides a large logic fabric with significant embedded memory and a high pin-count package, aimed at industrial designs that require flexible, reprogrammable digital logic with robust operating conditions.

Key capabilities include 170,100 logic elements, approximately 5.35 Mbits of on-chip RAM, and 228 I/O pins, delivered in a 676-ball FCBGA surface-mount package with an operating range from −40 °C to 100 °C and a core supply window of 825 mV to 876 mV.

Key Features

• Core Logic 170,100 logic elements provide a large programmable fabric for implementing complex digital functions and custom accelerators.
• Embedded Memory Approximately 5.35 Mbits of on-chip RAM for buffering, state storage, and data-path implementations.
• I/O Density 228 I/O pins support broad interface connectivity and multi-channel peripheral integration.
• Power Specified core voltage range of 825 mV to 876 mV to match precise supply and power-rail requirements.
• Package & Mounting 676-ball FCBGA (27 × 27 mm) surface-mount package for high-density board integration and compact system layouts.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployments in demanding environments.
• Manufacturer Supplied by AMD and compliant with RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation Industrial-grade temperature range and broad I/O count allow implementation of sensor interfacing, motor control logic, and protocol conversion in factory and process automation systems.
• Embedded Signal Processing Large logic capacity and several Mbits of embedded RAM support custom data-paths, buffering, and real-time signal processing blocks.
• Protocol Bridging and I/O Aggregation High I/O density enables consolidation of multiple peripheral interfaces and implementation of protocol translators on a single device.

Unique Advantages

• High Logic Capacity: 170,100 logic elements enable implementation of sizeable digital designs without external glue logic.
• Significant On-Chip Memory: Approximately 5.35 Mbits of embedded RAM reduces dependency on external memory for many buffering and stateful tasks.
• Extensive I/O: 228 I/Os facilitate multi-channel connectivity and flexible system interfacing options.
• Industrial Operating Range: Rated −40 °C to 100 °C to meet environmental demands in industrial deployments.
• Compact High-Density Package: 676-FCBGA (27×27) surface-mount package allows high integration density in space-constrained designs.
• Tight Core Voltage Specification: Defined supply window (825 mV to 876 mV) supports predictable power design and voltage planning.

Why Choose XCAU15P-2FFVB676I?

The XCAU15P-2FFVB676I balances substantial logic resources, embedded memory, and high I/O count in a compact FCBGA package, making it suitable for industrial-scale embedded designs that require reprogrammable logic and reliable operation across a wide temperature range. Its defined supply and package specifications simplify integration into controlled-power, high-density boards.

Backed by AMD manufacturing and RoHS compliance, this device is positioned for customers designing industrial control, embedded processing, or I/O-intensive systems who need a high-capacity FPGA with predictable electrical and thermal characteristics.

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