XCAU15P-2SBVB484I

The XCAU15P-2SBVB484I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC provided in a 484-ball FCBGA/BFBGA package. It delivers a high logic density device with substantial embedded memory and a large number of user I/O, suitable for industrial-grade deployments.

Key attributes include 170,100 logic elements, approximately 5.35 Mbits of embedded RAM, 204 user I/O pins, and an operating temperature range rated from -40 °C to 100 °C. The device operates with a core supply range of 825 mV to 876 mV and is RoHS compliant.

Key Features

• Core Logic Capacity  170,100 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 5.35 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Resources  204 user I/O pins accommodate multiple external interfaces and system-level connectivity requirements.
• Power Supply  Core supply range specified at 825 mV to 876 mV for the device's operating voltage domain.
• Package & Mounting  Available in a 484-ball FCBGA/BFBGA package (supplier package: 484-FCBGA, 19×19) designed for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, supporting deployment in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital implementations  Use the 170,100 logic elements to realize complex custom logic, state machines, and protocol processing.
• Memory-intensive functions  Approximately 5.35 Mbits of embedded RAM supports buffering, lookup tables, and on-chip data staging.
• I/O-rich systems  204 user I/O pins enable multi-channel interfacing and aggregation of peripheral signals in compact board designs.

Unique Advantages

• Substantial logic capacity: 170,100 logic elements enable large-scale programmable logic integration without immediate escalation to larger packages.
• On-chip memory resources: Approximately 5.35 Mbits of embedded RAM reduces dependence on external memory for many buffering and state requirements.
• Generous I/O count: 204 user I/O pins simplify system integration where multiple interfaces or channels are required.
• Industrial-rated thermal range: -40 °C to 100 °C operation supports installations in industrial ambient conditions.
• Compact BGA packaging: 484-FCBGA (19×19) surface-mount package supports high-density PCB layouts and automated assembly.
• Regulatory compliance: RoHS compliant to meet environmental directives for lead-free assemblies.

Why Choose XCAU15P-2SBVB484I?

The XCAU15P-2SBVB484I positions itself as a high-capacity, industrial-grade FPGA option that balances substantial programmable logic, on-chip memory, and a wide complement of I/O in a compact 484-ball FCBGA/BFBGA package. Its specified core voltage range and broad operating temperature make it suitable for designs that require stable operation across varied industrial conditions.

This device is well suited for engineering teams building complex digital subsystems that need integrated memory, extensive I/O, and a robust thermal operating window. Its combination of resources supports scalable designs while maintaining predictable supply and mounting characteristics for production deployment.

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