XCAU15P-2FFVB676E

The XCAU15P-2FFVB676E is an Artix® UltraScale+ field-programmable gate array (FPGA) IC designed to deliver substantial programmable logic capacity and on-chip memory in a compact package. It provides approximately 170,100 logic elements, approximately 5.35 Mbits of embedded memory, and 228 I/O pins, making it suitable for designs that require significant integration of logic, memory, and external interfaces.

This surface-mount, extended-grade device is supplied in a 676-ball FCBGA package (27×27) and operates with a core voltage range of 825 mV–876 mV and an operating temperature range of 0°C–100°C. The device is RoHS compliant.

Key Features

• Logic Capacity Approximately 170,100 logic elements to support complex, programmable digital architectures.
• Embedded Memory Approximately 5.35 Mbits of on-chip RAM (5,347,738 bits) for buffering, state storage, and memory-intensive functions.
• I/O Density 228 I/O pins to accommodate multiple high-density interfaces and external peripherals.
• Power Core supply voltage range of 825 mV–876 mV for the device core.
• Package & Mounting 676-FCBGA (27×27) package in a surface-mount form factor for board-level integration.
• Temperature & Grade Extended grade device with an operating temperature range of 0°C–100°C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Configurable digital logic — Implement custom logic, state machines, and hardware accelerators using the device’s ~170,100 logic elements.
• High-density I/O interfacing — Support multiple external interfaces and protocol bridging with 228 I/O pins.
• Memory-intensive functions — Use approximately 5.35 Mbits of embedded memory for buffering, packet storage, or on-chip data processing.

Unique Advantages

• High logic density: Approximately 170,100 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 5.35 Mbits of embedded RAM supports local buffering and reduces external memory dependence.
• Generous I/O count: 228 I/O pins provide flexibility for interfacing to sensors, peripherals, and high-speed I/O standards.
• Compact package: 676-FCBGA (27×27) delivers a high-pin-count solution in a compact surface-mount footprint for space-constrained designs.
• Extended-grade operation: Rated for 0°C–100°C operation, suitable for a range of commercial and extended-temperature environments.
• Regulatory compliance: RoHS compliant to support environmentally conscious product designs.

Why Choose XCAU15P-2FFVB676E?

The XCAU15P-2FFVB676E positions itself as a high-capacity, integrated FPGA option within the Artix® UltraScale+ family, combining substantial logic resources, on-chip memory, and a high I/O count in a compact 676-ball FCBGA package. Its extended-grade rating and RoHS compliance make it a practical choice for designs that require both density and environmental compliance.

This device is well suited for engineering teams seeking to consolidate multiple functions into a single programmable device, reduce bill-of-materials complexity, and leverage a platform with substantial embedded memory and I/O resources. The defined operating voltage and temperature ranges help engineers plan power delivery and thermal management for reliable system operation.

Request a quote or submit an inquiry to receive pricing and availability for the XCAU15P-2FFVB676E.