XCAU10P-2SBVB484I
| Part Description |
Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 3670016 96250 484-BFBGA, FCBGA |
|---|---|
| Quantity | 1,899 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA, FCBGA | Number of I/O | 204 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5500 | Number of Logic Elements/Cells | 96250 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3670016 |
Overview of XCAU10P-2SBVB484I – Artix® UltraScale+ FPGA, 204 I/O, 484‑FCBGA, Industrial
The XCAU10P-2SBVB484I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) packaged in a 484‑BFBGA (484‑FCBGA, 19×19) surface‑mount package. It provides reprogrammable logic with 96,250 logic elements, approximately 3.67 Mbits of embedded memory, and 204 I/O pins in an industrial‑grade device.
This device targets designs that require substantial on‑chip logic and memory capacity combined with a high I/O count and industrial operating range, while operating from a defined low‑voltage core supply (825 mV to 876 mV).
Key Features
- Core Logic 96,250 logic elements provide programmable logic capacity for implementation of custom digital functions and state machines.
- Embedded Memory Approximately 3.67 Mbits of on‑chip RAM for buffering, FIFOs, and other memory‑centric logic.
- I/O 204 user I/O pins support wide interfacing options and parallel connectivity in compact board layouts.
- Power Core supply range specified at 825 mV to 876 mV to match system power-rail requirements and ensure predictable operation at rated voltages.
- Package & Mounting 484‑BFBGA / 484‑FCBGA (19×19) surface‑mount package for high density integration in space‑constrained designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet extended temperature requirements in industrial environments.
- Environmental Compliance RoHS compliant to support environmentally responsible manufacturing and assembly processes.
Typical Applications
- Reprogrammable logic systems — Deploy custom digital functions and state machines using the device’s 96,250 logic elements and embedded RAM.
- I/O‑dense interfaces — Implement parallel data paths and multiple external interfaces using the 204 available I/O pins.
- Industrial embedded platforms — Leverage the industrial temperature rating and robust package for long‑life embedded deployments.
Unique Advantages
- High logic capacity in a compact package: 96,250 logic elements in a 484‑FCBGA allow dense logic implementations without large board area.
- On‑chip memory for data buffering: Approximately 3.67 Mbits of embedded RAM reduces external memory dependency and simplifies BOM.
- Rich I/O for flexible integration: 204 I/O pins support multiple parallel and peripheral connections directly from the FPGA.
- Industrial temperature operation: −40 °C to 100 °C rating supports deployment in temperature‑challenging industrial environments.
- Controlled core supply: Defined 825 mV to 876 mV voltage range enables consistent power management and integration into low‑voltage systems.
- RoHS compliant: Meets common environmental requirements for modern electronics assembly and distribution.
Why Choose XCAU10P-2SBVB484I?
The XCAU10P-2SBVB484I brings together substantial programmable logic, meaningful embedded memory, and a high I/O count in a compact industrial‑grade FCBGA package. It is suited to designers who need reprogrammable, on‑chip resources and a predictable low‑voltage supply window for robust embedded solutions.
Its combination of logic capacity, embedded RAM, and extended temperature range delivers a scalable platform for medium‑to‑high complexity designs where board space, I/O density, and industrial reliability are priorities.
Request a quote or submit a purchase inquiry to obtain pricing and lead‑time information for the XCAU10P-2SBVB484I.

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