XCAU10P-2FFVB676E

The XCAU10P-2FFVB676E is an AMD Artix® UltraScale+ FPGA presented in a 676-ball FCBGA (27×27) surface-mount package. It integrates programmable logic, embedded RAM and a substantial I/O complement to support board-level digital designs.

With 96,250 logic elements, approximately 3.67 Mbits of on-chip RAM and 228 I/O pins, this extended-grade device targets applications that need dense logic resources and significant embedded memory in a compact FCBGA footprint while operating from a low-voltage core supply.

Key Features

• Core Logic 96,250 logic elements provide the FPGA fabric for complex, custom digital functions and parallel processing implementations.
• Embedded Memory Approximately 3.67 Mbits of on-chip RAM to support buffering, frame storage, or local data structures without immediate external memory.
• I/O Capacity 228 I/O pins enable connectivity to multiple peripherals, interfaces and board-level signals from a single device.
• Power Core supply voltage range is specified at 825 mV to 876 mV, allowing designs to target the device's recommended low-voltage operating window.
• Package & Mounting 676-ball BGA (FCBGA) 27×27 package in a surface-mount form factor for compact PCB implementation and high pin density.
• Temperature & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High-density I/O designs — The 228 available I/O pins support multiple interfaces and complex board-level signal routing.
• Memory-intensive logic — Approximately 3.67 Mbits of embedded RAM combined with 96,250 logic elements suits buffering, packet processing, and local data handling.
• Compact, board-level integration — The 676-FCBGA (27×27) surface-mount package fits space-constrained PCBs requiring high logic and pin counts.
• Temperature-controlled systems — Extended-grade operation from 0 °C to 100 °C addresses environments within that thermal range.

Unique Advantages

• High logic density: 96,250 logic elements enable large custom digital designs without multiple devices.
• Significant on-chip RAM: Approximately 3.67 Mbits of embedded memory reduces dependence on external memory for many use cases.
• Large I/O complement: 228 I/Os support numerous interfaces and simplify system-level routing by consolidating signals into a single FPGA.
• Compact FCBGA package: 676-ball (27×27) footprint provides high pin count in a board-friendly surface-mount BGA form factor.
• Extended-grade operation: Rated for 0 °C to 100 °C operation and RoHS compliant for environmental conformity.

Why Choose XCAU10P-2FFVB676E?

The XCAU10P-2FFVB676E combines a substantial logic fabric, multiple megabits of embedded RAM and a high I/O count within a compact 676-FCBGA package, making it a practical choice for designs that require consolidated programmable logic and on-chip memory in a surface-mount form factor. Its extended-grade temperature range and RoHS compliance align with applications that operate within 0 °C to 100 °C.

Manufactured by AMD, this Artix® UltraScale+ device is suited to customers seeking a single-device solution for complex, memory-aware digital functions where board space and pin density are important considerations.

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