XCAU10P-1FFVB676I

The XCAU10P-1FFVB676I is an Artix® UltraScale+ field programmable gate array (FPGA) IC in a 676‑ball FCBGA package. It provides programmable logic resources and on-chip memory in a compact surface-mount footprint and is specified for industrial temperature operation.

This device is characterized by its logic capacity, embedded RAM, and I/O density, making it suitable for applications that require reconfigurable logic implemented in a 676‑FCBGA (27×27) package with RoHS compliance.

Key Features

• Logic Capacity  Approximately 96,250 logic elements to implement complex programmable logic and custom digital functions.
• Logic Blocks  5,500 configurable logic blocks (CLBs) for structured logic partitioning and resource allocation.
• Embedded Memory  Approximately 3.67 Mbits of embedded memory for buffering, state storage, and on‑chip data processing.
• I/O Density  228 I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Package and Mounting  676‑FCBGA (27×27) surface‑mount package providing a compact, board‑level footprint.
• Supply Voltage  Specified operating supply range from 698 mV to 742 mV.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Significant logic resources: The approximately 96,250 logic elements support complex, high‑density logic implementations without external programmable logic blocks.
• On‑chip memory capacity: Approximately 3.67 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage needs.
• High I/O count: 228 I/O pins enable flexible interfacing and integration with multiple external devices and subsystems.
• Industrial temperature range: Operation from −40 °C to 100 °C allows deployment in thermally demanding industrial environments.
• Compact surface‑mount package: The 676‑FCBGA (27×27) package delivers a dense solution for space‑constrained PCB designs.
• RoHS compliance: Environmentally compliant material selection supports regulatory requirements.

Why Choose XCAU10P-1FFVB676I?

The XCAU10P-1FFVB676I combines a substantial logic element count, embedded memory, and a high I/O count within a 676‑ball FCBGA surface‑mount package, providing a balanced platform for industrial reconfigurable logic designs. Its specified supply voltage range and wide operating temperature support deployment where consistent electrical and thermal behavior are required.

This device is appropriate for engineers and procurement teams seeking a RoHS‑compliant Artix® UltraScale+ FPGA with clear, verifiable specifications for logic capacity, memory, I/O, package, and industrial temperature performance.

Request a quote or submit a pricing inquiry today to evaluate XCAU10P-1FFVB676I for your next design.