XCAU10P-1FFVB676E

The XCAU10P-1FFVB676E is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) provided in a 676-FCBGA (27×27) surface-mount package. It delivers substantial programmable logic capacity with 96,250 logic elements and approximately 3.67 Mbits of embedded memory, making it suitable for designs that require significant on-chip resources and flexible I/O.

This device is offered in an Extended grade with an operating temperature range of 0°C to 100°C and a nominal supply window of 825 mV to 876 mV, addressing applications that need mid-range thermal performance and low-voltage operation in a high-density BGA package.

Key Features

• Logic Capacity  Offers 96,250 logic elements to implement complex programmable logic and custom hardware functions in a single device.
• Embedded Memory  Contains approximately 3.67 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• General-Purpose I/O  Provides 228 I/O pins for broad interfacing options to peripherals, sensors, and external logic.
• Package and Mounting  Delivered in a 676-FCBGA (27×27) ball-grid array, designed for surface-mount assembly in compact, high-density board layouts.
• Power  Operates within a supply range of 825 mV to 876 mV, suitable for systems using low-voltage core rails.
• Temperature and Grade  Extended grade device specified for operation from 0°C to 100°C, meeting applications that require this thermal range.
• Compliance  RoHS compliant for alignment with lead-free manufacturing requirements.

Typical Applications

• Custom Digital Logic  Implement complex state machines, protocol bridges, and custom datapaths using the device’s 96,250 logic elements and embedded RAM.
• High-Density I/O Control  Manage multiple peripheral interfaces and board-level signals with 228 available I/O pins for flexible connectivity.
• On-Chip Data Buffering  Leverage approximately 3.67 Mbits of embedded memory for packet buffering, temporary storage, and streaming applications.

Unique Advantages

• High Logic Integration: 96,250 logic elements reduce the need for multiple discrete components, simplifying system design and lowering BOM count.
• Substantial On-Chip Memory: Approximately 3.67 Mbits of embedded RAM enable local data handling and reduce external memory dependency.
• Extensive I/O Count: 228 I/O pins provide flexible interfacing options for complex board-level integration and multi-port connectivity.
• Compact, Surface-Mount BGA: 676-FCBGA (27×27) packaging supports high-density board layouts while maintaining a standardized BGA footprint for assembly.
• Low-Voltage Core Operation: Supply range of 825 mV to 876 mV aligns with low-voltage system rails to support modern power architectures.
• RoHS Compliant: Meets lead-free manufacturing requirements for environmentally conscious production processes.

Why Choose XCAU10P-1FFVB676E?

The XCAU10P-1FFVB676E combines substantial programmable logic, on-chip memory, and a large I/O set in a 676-FCBGA surface-mount package, positioning it for designs that require high integration in a compact form factor. Its Extended grade and 0°C to 100°C operating range suit applications with mid-range thermal requirements, while the low-voltage supply supports modern power domains.

This device is appropriate for engineers developing systems that need significant on-chip resources and flexible connectivity—reducing external component count and enabling tighter system integration. Its specification set supports scalable implementations where logic density, embedded RAM, and plentiful I/O are primary design drivers.

Request a quote or submit your specifications to get pricing and availability for the XCAU10P-1FFVB676E. Our team can provide lead-time details and support your procurement process.