XC7VX980T-L2FFG1926E

IC FPGA 720 I/O 1926FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 720 55296000 979200 1924-BBGA, FCBGA

Quantity 1,209 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1926-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O720Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs76500Number of Logic Elements/Cells979200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296000

Overview of XC7VX980T-L2FFG1926E – Virtex®-7 XT FPGA, 1924-BBGA FCBGA (45×45)

The XC7VX980T-L2FFG1926E is a Virtex®-7 XT field programmable gate array (FPGA) from AMD. It provides a high-density FPGA architecture combining large logic capacity with substantial on-chip memory and a high I/O count for complex digital systems.

Engineered for applications that require extensive programmable logic, embedded memory, and broad I/O connectivity, this extended-grade device offers a platform suited to demanding designs while operating within a defined core voltage range and standard extended temperature window.

Key Features

  • Core Logic  Approximately 979,200 logic elements and 76,500 CLBs provide significant programmable logic capacity for large designs and parallel processing.
  • Embedded Memory  Approximately 55.296 Mbits of on-chip RAM to support buffering, temporary storage, and memory-hungry algorithms without immediate external SRAM/DDR dependence.
  • I/O Density  720 user I/O pins enable high-channel count interfaces and dense system connectivity for external peripherals and subsystems.
  • Power  Core voltage supply specified from 0.970 V to 1.03 V to match system power design and regulator selection requirements.
  • Package & Mounting  Surface-mount package in 1924-BBGA FCBGA format; supplier device package listed as 1926-FCBGA (45×45) for PCB footprint and mechanical planning.
  • Grade & Temperature  Extended grade device with an operating temperature range of 0 °C to 100 °C for applications requiring above-room-temperature operation.
  • Compliance  RoHS compliant to meet common environmental and hazardous-substance requirements.

Typical Applications

  • High-density logic implementations  Use the abundant logic elements for complex FPGA-based state machines, data path processing, and custom compute pipelines.
  • Memory-intensive designs  Take advantage of approximately 55.296 Mbits of embedded RAM for buffering, packet processing, and intermediate data storage.
  • High I/O connectivity systems  Leverage 720 I/O pins to integrate multiple peripherals, sensors, interfaces, and high-channel-count front-end electronics.

Unique Advantages

  • High programmable capacity: The combination of roughly 979,200 logic elements and 76,500 CLBs supports large and complex FPGA implementations without frequent partitioning.
  • Substantial on-chip memory: Approximately 55.296 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary storage needs.
  • Extensive I/O count: 720 user I/Os facilitate dense connectivity and flexible interface options directly from the FPGA package.
  • Surface-mount FCBGA packaging: The 1924-BBGA / 1926-FCBGA (45×45) package enables compact board integration while supporting high pin counts.
  • Extended-grade operation: Rated for 0 °C to 100 °C operation to suit systems that operate above standard commercial ambient conditions.
  • RoHS compliant: Conforms to RoHS requirements for reduced hazardous-substance content.

Why Choose XC7VX980T-L2FFG1926E?

The XC7VX980T-L2FFG1926E is positioned for engineering teams and procurement seeking a high-capacity Virtex®-7 XT FPGA from AMD that integrates substantial logic resources, significant embedded memory, and a large I/O complement in a surface-mount FCBGA package. Its extended-grade temperature rating and defined core voltage range make it suitable for designs that require robustness across a broader operating envelope.

For complex digital systems that demand scalable logic, on-chip storage, and extensive connectivity, this device delivers a well-specified building block. Documentation is available for the Virtex-7 series to support detailed design and integration planning.

Request a quote or contact sales to obtain pricing, lead time, and availability for XC7VX980T-L2FFG1926E.

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