XC7VX980T-2FFG1930C

The XC7VX980T-2FFG1930C is a Virtex®-7 XT field programmable gate array from AMD designed for high-density programmable logic implementations. It provides 979,200 logic elements, approximately 55.3 Mbits of embedded memory, and up to 900 I/O pins to support complex, I/O‑intensive designs.

Packaged in a 1924‑BBGA FCBGA (supplier package: 1930‑FCBGA, 45×45) and rated for commercial operation, this device targets designs that require large logic capacity, substantial on-chip memory, and flexible I/O counts while operating within a 0 °C to 85 °C range and a core supply window of 0.970 V to 1.03 V.

Key Features

• Core Logic 979,200 logic elements for implementing large, complex digital designs and high-density programmable logic functions.
• Embedded Memory Approximately 55.3 Mbits of on-chip RAM to host buffers, LUT-based memory, and on-chip data storage for latency‑sensitive functions.
• I/O Capacity Up to 900 I/O pins to support wide bus interfaces, parallel data paths, and extensive external connectivity.
• Power and Supply Core voltage supply range of 0.970 V to 1.03 V to match system power-rail planning and regulator design requirements.
• Package and Mounting 1924‑BBGA, FCBGA package with supplier device package 1930‑FCBGA (45×45); surface-mount mounting type for standard PCB assembly processes.
• Temperature and Grade Commercial grade device with an operating temperature range from 0 °C to 85 °C.
• Regulatory RoHS compliant to support lead‑free manufacturing processes.

Typical Applications

• Complex digital logic and signal processing — Implement large-scale logic functions and datapaths that leverage 979,200 logic elements and substantial embedded memory.
• High‑I/O control and interfacing — Use up to 900 I/O pins for broad peripheral connectivity, parallel interfaces, and extensive sensor or actuator networks.
• On‑chip buffering and temporary storage — Approximately 55.3 Mbits of embedded RAM supports buffering, packet queuing, and intermediate data storage for throughput-focused designs.

Unique Advantages

• Large logic capacity: 979,200 logic elements enable consolidation of complex subsystems into a single programmable device, reducing board-level component count.
• Significant embedded memory: Approximately 55.3 Mbits of on-chip RAM provides space for buffering and state storage without immediate external memory dependency.
• Extensive I/O resources: 900 I/O pins accommodate wide interfaces and multiple parallel channels, simplifying system-level interconnects.
• Commercial temperature grading: Rated for 0 °C to 85 °C operation to match a wide range of standard electronic applications.
• Surface-mount package: 1924‑BBGA/1930‑FCBGA (45×45) form factor supports modern PCB assembly practices and high-density layouts.
• RoHS compliance: Conforms to lead‑free assembly requirements for compliant manufacturing processes.

Why Choose XC7VX980T-2FFG1930C?

The XC7VX980T-2FFG1930C positions itself as a high-density Virtex®-7 XT FPGA option from AMD for designs that require a large amount of programmable logic, substantial on-chip RAM, and broad I/O capabilities. Its commercial-grade rating and surface-mount FCBGA package make it suitable for systems that prioritize integration and on-board consolidation under standard temperature ranges.

Choose this device when you need scalability in logic and memory resources within a single FPGA package, combined with the vendor support and ecosystem associated with the Virtex‑7 family from AMD.

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