XCAU20P-1FFVB676E

The XCAU20P-1FFVB676E is an Artix® UltraScale+ field programmable gate array (FPGA) in a 676-ball FCBGA package. It delivers high logic capacity and embedded memory in a surface-mount FCBGA (27 × 27) package suitable for designs that require dense programmable logic and significant on-chip RAM.

Key on-chip resources include 238,437 logic elements, 13,625 CLBs, approximately 7.34 Mbits of embedded memory and 228 user I/O. The device operates from a core voltage supply range of 825 mV to 876 mV and is specified for an operating temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity  Provides 238,437 logic elements and 13,625 CLBs for implementing complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 7.34 Mbits of on-chip RAM to support buffering, lookup tables and local data storage for accelerators and state machines.
• I/O Density  228 user I/O pins to support multiple high-pin-count interfaces and flexible system connectivity.
• Package & Mounting  676-ball FCBGA package (supplier device package: 676-FCBGA, 27×27) in a surface-mount form factor for compact board integration.
• Power  Core supply range specified from 825 mV to 876 mV to match system power provisioning requirements.
• Temperature & Grade  Extended-grade device rated for 0 °C to 100 °C operating temperature.
• Compliance  RoHS compliant.

Typical Applications

• Hardware Acceleration: Implement custom compute accelerators and data-path logic using the device’s 238,437 logic elements and approximately 7.34 Mbits of embedded memory.
• High-Density I/O Systems: Use the 228 user I/O pins to aggregate and bridge multiple peripheral interfaces in compact board layouts.
• Prototyping and Development: Leverage the CLB and logic resources for system prototyping, hardware verification and iterative design refinement.

Unique Advantages

• High Logic and CLB Count: 238,437 logic elements and 13,625 CLBs enable complex logic implementations without immediate need for multi-chip partitioning.
• Substantial On-Chip RAM: Approximately 7.34 Mbits of embedded memory supports buffering, caches and stateful logic close to compute resources.
• Robust I/O Capacity: 228 I/O pins provide flexibility for integrating multiple interfaces and parallel data paths.
• Compact FCBGA Packaging: 676-ball FCBGA (27×27) surface-mount package allows high-density board designs while keeping a small PCB footprint.
• Defined Power Envelope: Core supply specified between 825 mV and 876 mV helps ensure predictable power planning during system design.
• Extended Operating Range: Rated for 0 °C to 100 °C operation and supplied as an extended-grade device for broader deployment environments.

Why Choose XCAU20P-1FFVB676E?

The XCAU20P-1FFVB676E positions itself as a high-capacity programmable logic device that combines substantial logic resources, embedded memory and a high I/O count in a 676-ball FCBGA surface-mount package. Its defined power and temperature specifications make it suitable for designs that require predictable electrical and thermal planning.

This device is well suited to engineers and teams developing compute- and I/O-heavy designs—such as hardware accelerators, prototyping platforms and complex interface controllers—who need a single-chip solution with significant on-chip resources and compact packaging. RoHS compliance and extended-grade temperature support add to its long-term integration value.

Request a quote or contact sales to check pricing, availability and to discuss how the XCAU20P-1FFVB676E can meet your design requirements.