XCAU20P-2SFVB784E

The XCAU20P-2SFVB784E is an Artix® UltraScale+ field programmable gate array (FPGA) IC from AMD. It provides programmable logic resources, embedded memory, and a high count of I/O in a 784-FCBGA (23×23) surface-mount package.

This device is positioned for designs that require substantial on-chip logic and memory capacity, a wide I/O complement, low-voltage core operation, and an extended operating temperature range.

Key Features

• Programmable Logic – 238,437 logic elements for implementing complex custom digital functions and state machines.
• Embedded Memory – Approximately 7.34 Mbits of on-chip RAM to support buffering, look-up tables, and local data storage.
• I/O Capacity – 228 user I/O pins to interface with peripherals, sensors, and high-speed buses.
• Package & Mounting – 784-FCBGA (23×23) package, surface-mount for compact board-level integration.
• Power – Core supply range of 825 mV to 876 mV to match target power rails and low-voltage system designs.
• Temperature Grade – Extended grade with an operating range of 0 °C to 100 °C for use in thermally demanding environments.
• Compliance – RoHS-compliant, supporting lead-free manufacturing processes.

Typical Applications

• Custom Digital Logic – Implement application-specific accelerators, protocol engines, and control logic using the device’s 238,437 logic elements.
• Memory-Intensive Functions – Use the approximately 7.34 Mbits of embedded memory for packet buffering, FIFOs, and local data storage.
• I/O-Rich Interfaces – Bridge multiple peripherals or integrate diverse sensors and interfaces leveraging 228 user I/Os.

Unique Advantages

• High Logic Density: 238,437 logic elements enable complex designs and consolidation of multiple functions into a single device, reducing BOM count.
• Substantial On-Chip Memory: Approximately 7.34 Mbits of embedded RAM lowers dependence on external memory for many common buffering and storage needs.
• Broad I/O Count: 228 I/Os provide flexibility for multi-interface designs and high channel counts without external multiplexing.
• Compact BGA Packaging: 784-FCBGA (23×23) allows high integration in space-constrained boards while supporting surface-mount assembly.
• Low-Voltage Core: 825 mV to 876 mV supply range supports low-power system architectures and modern power domains.
• Extended Temperature Grade: Rated 0 °C to 100 °C for reliable operation in a wider range of thermal environments.

Why Choose XCAU20P-2SFVB784E?

The XCAU20P-2SFVB784E delivers a balance of high logic capacity, embedded memory, and extensive I/O in a compact 784-FCBGA surface-mount package. Its low-voltage core and extended temperature grade make it suitable for system designs that demand dense programmable logic and stable operation across a broad thermal range.

This FPGA is appropriate for engineers and teams seeking to consolidate functions onto a single programmable device while maintaining flexibility for future iterations. Its combination of logic elements, on-chip RAM, and I/O count provides a scalable foundation for complex digital designs.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XCAU20P-2SFVB784E.