XCAU25P-1FFVB676E

The XCAU25P-1FFVB676E is an Artix® UltraScale+ field programmable gate array (FPGA) in a 676-BBGA FCBGA package, supplied by AMD. It delivers a high logic density platform with 308,437 logic elements and approximately 11.01 Mbits of embedded memory, suitable for complex programmable-logic designs.

With 280 I/O pins, an extended-grade operating range of 0 °C to 100 °C, and a specified voltage supply range of 825 mV to 876 mV, this surface-mount FPGA supports designs that require significant on-chip logic, memory, and I/O integration in a compact 676-FCBGA (27×27) package.

Key Features

• Logic Capacity 17,625 logic blocks and 308,437 logic elements provide substantial on-chip programmable logic resources for complex digital functions.
• Embedded Memory Approximately 11.01 Mbits of on-chip RAM for buffering, state storage, and intermediate data handling without external memory.
• I/O Density 280 available I/O pins to support broad peripheral and interface options within a single device footprint.
• Power Specified voltage supply range of 825 mV to 876 mV to match target power-rail requirements and system-level power planning.
• Package & Mounting 676-BBGA FCBGA package (supplier package: 676-FCBGA (27x27)), designed for surface-mount assembly in space-constrained designs.
• Operating Range & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for environmental standards.

Typical Applications

• Custom digital logic and prototyping Use the device’s 308,437 logic elements for implementing complex custom logic, state machines, and hardware accelerators within development platforms.
• Embedded memory–intensive designs Approximately 11.01 Mbits of on-chip RAM supports buffering, FIFOs, and on-chip data storage to reduce reliance on external memory.
• High-pin-count I/O systems With 280 I/Os, the FPGA fits systems that require multiple interfaces, parallel buses, or numerous signal connections in a single component.

Unique Advantages

• High on-chip resource integration: A combination of 308,437 logic elements and ~11.01 Mbits of RAM consolidates logic and memory needs into one device, simplifying board-level integration.
• Compact surface-mount package: The 676-FCBGA (27×27) package enables a dense footprint while preserving substantial logic and I/O capacity for space-constrained assemblies.
• Clear power specification: The defined voltage supply range (825 mV–876 mV) supports precise power budgeting and regulator selection during system design.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to meet applications that require a broader operating range than standard commercial parts.
• RoHS compliant: Environmentally compliant manufacturing and materials to support regulatory and sustainability requirements.

Why Choose XCAU25P-1FFVB676E?

The XCAU25P-1FFVB676E positions itself as a high-density Artix® UltraScale+ FPGA option that balances significant programmable logic capacity, embedded memory, and substantial I/O in a compact 676-FCBGA package. Its extended-grade temperature range and defined supply window make it suitable for designs that require reliable operation within the specified environmental and electrical bounds.

This part is well suited for engineering teams and procurement looking for a single-chip solution to implement complex digital logic, on-chip buffering, and multi-signal interfacing while maintaining a compact board footprint and compliance with RoHS requirements.

Request a quote or submit a pricing and availability inquiry to evaluate the XCAU25P-1FFVB676E for your next design.