XCAU25P-2FFVB676E

The XCAU25P-2FFVB676E is an Artix® UltraScale+ field programmable gate array (FPGA) IC from AMD. It provides high logic density, substantial embedded memory, and a broad I/O complement in a 676-ball FCBGA surface-mount package.

With 308,437 logic elements, approximately 11.01 Mbits of on-chip RAM, and up to 280 I/Os, this device is suited for designs that require a combination of programmable logic capacity, embedded memory, and flexible I/O within an extended-temperature surface-mount footprint.

Key Features

• Core Logic 308,437 logic elements and 17,625 configurable logic blocks (CLBs) to implement complex digital designs.
• Embedded Memory Approximately 11.01 Mbits of on-chip RAM for data buffering, FIFO, and state storage.
• I/O Up to 280 I/O pins to support multiple peripheral interfaces and board-level connections.
• Power Specified core voltage supply range of 825 mV to 876 mV for device operation.
• Package & Mounting 676-ball FCBGA (27×27) package, surface-mountable for compact PCB integration.
• Operating Range & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density digital logic — Implement complex programmable logic functions using 308,437 logic elements and 17,625 CLBs.
• Memory-intensive subsystems — On-chip RAM (approximately 11.01 Mbits) supports buffering, lookup tables, and embedded data structures.
• I/O-rich interfaces — Use up to 280 I/Os to connect sensors, peripherals, or board-level buses.
• Compact surface-mount deployments — 676-FCBGA (27×27) package enables dense PCB layouts while maintaining a robust surface-mount footprint.

Unique Advantages

• High logic capacity: 308,437 logic elements provide significant room to implement large or complex logic nets without external glue logic.
• Substantial embedded memory: Approximately 11.01 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Versatile I/O count: Up to 280 I/Os allow integration with multiple peripherals and interfaces directly at the FPGA.
• Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package facilitates dense board integration and automated assembly.
• Controlled power envelope: Core supply specified between 825 mV and 876 mV enables predictable power budgeting for system design.
• Extended operating grade: Rated 0 °C to 100 °C to meet a range of commercial and extended-temperature deployment scenarios.

Why Choose XCAU25P-2FFVB676E?

The XCAU25P-2FFVB676E balances high logic density, meaningful on-chip memory, and substantial I/O capability in a compact 676-FCBGA package. Its specification set is suited to designers who need programmable logic capacity combined with embedded RAM and flexible connectivity while maintaining a surface-mount form factor and an extended operating temperature range.

Manufactured as part of the Artix® UltraScale+ family by AMD, this device is a practical choice for teams building dense programmable designs that require predictable power characteristics and RoHS-compliant material composition.

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