XCAU25P-1SFVB784E

The XCAU25P-1SFVB784E is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC from AMD. It provides substantial programmable logic capacity together with embedded memory and a high count of general-purpose I/O in a 784-ball FCBGA package.

This device integrates 308,437 logic elements, approximately 11.01 Mbits of embedded memory, and 304 I/O pins. It is supplied in a 784-FCBGA (23×23) surface-mount package, operates on a core supply range of 0.825 V to 0.876 V, and is rated for an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 308,437 logic elements and 17,625 configurable logic blocks provide substantial programmable resources for complex logic implementations.
• Embedded Memory — Approximately 11.01 Mbits of on-chip RAM to support buffering, state storage, and data processing without external memory.
• I/O and Package — 304 I/O pins in a 784-FCBGA (23×23) supplier device package, delivered as a surface-mount component for compact board-level integration.
• Power — Narrow core supply voltage range of 0.825 V to 0.876 V suitable for controlled low-voltage system designs.
• Temperature and Grade — Extended-grade device rated for operation from 0 °C to 100 °C.
• Compliance — RoHS compliant for environmental regulatory alignment.

Unique Advantages

• High programmable density: 308,437 logic elements enable implementation of sizeable custom logic and complex state machines on a single device.
• Substantial on-chip memory: Approximately 11.01 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and board layout.
• Broad I/O capability in a compact package: 304 I/O pins in a 784-FCBGA (23×23) package allow dense connectivity while maintaining a manageable PCB footprint.
• Stable low-voltage core: The defined 0.825 V–0.876 V supply window supports consistent power design and supply sequencing.
• Extended-grade operation: Rated for 0 °C to 100 °C to support designs that require wider-than-commercial temperature tolerance.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCAU25P-1SFVB784E?

The XCAU25P-1SFVB784E positions itself as a high-capacity, FPGA-based building block for designs that require extensive programmable logic, meaningful on-chip memory, and a high I/O count in a compact FCBGA package. Its defined supply range and extended operating temperature rating provide predictable electrical and thermal parameters for system-level design.

This device is suitable for customers seeking a scalable, programmable hardware platform with significant embedded resources and RoHS compliance, enabling long-term design planning within the stated electrical and environmental limits.

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