XCAU25P-1FFVB676I

The XCAU25P-1FFVB676I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC from AMD provided in a 676-FCBGA (27×27) surface-mount package. It delivers a large programmable fabric with 17625 logic blocks and 308,437 logic elements, approximately 4.93 Mbits of embedded memory, and up to 280 I/O pins.

Designed for industrial applications, the device supports a supply voltage range of 825 mV to 876 mV and an operating temperature range of −40 °C to 100 °C. It is RoHS compliant.

Key Features

• Programmable Logic Capacity 17625 logic blocks and 308,437 logic elements provide substantial fabric density for complex digital designs.
• Embedded Memory Approximately 4.93 Mbits of on-chip RAM for buffering, lookup tables, and intermediate storage.
• I/O Count Up to 280 general-purpose I/O pins to support extensive interfacing with peripherals and external devices.
• Power Supply Specified supply voltage range of 825 mV to 876 mV for core operation.
• Package and Mounting 676-FCBGA (27×27) package in a surface-mount form factor for high-density board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Automation and Control — Industrial-grade temperature range and high logic capacity enable complex control algorithms and interface aggregation for factory equipment.
• High-Density Digital Processing — Large logic element count and embedded memory support intensive digital signal processing and custom compute blocks.
• Multi‑I/O Interface Systems — Up to 280 I/O pins allow integration with sensors, communication transceivers, and peripheral subsystems.
• Embedded Systems Requiring Compact Packaging — 676-FCBGA surface-mount package provides a compact footprint for space-constrained system designs.

Unique Advantages

• High Logic Integration: 308,437 logic elements reduce the need for multiple FPGAs in complex designs, simplifying system architecture.
• Significant On-Chip Memory: Approximately 4.93 Mbits of embedded RAM supports buffering and lookup-table requirements without external memory.
• Wide Operating Range: −40 °C to 100 °C rating aligns with industrial deployment requirements for temperature resilience.
• High I/O Count: 280 available I/Os provide flexible connectivity for diverse peripherals and subsystem interfaces.
• Compact, Surface-Mount Package: 676-FCBGA (27×27) enables high-density PCB layouts while maintaining thermal and mechanical integrity.
• RoHS Compliant: Meets RoHS requirements for environmental and regulatory considerations.

Why Choose XCAU25P-1FFVB676I?

The XCAU25P-1FFVB676I positions itself as a high-capacity, industrial-grade Artix UltraScale+ FPGA suited for designs that demand large programmable logic fabrics, substantial embedded memory, and extensive I/O in a compact package. Its specified supply voltage range and wide operating temperature window make it appropriate for industrial applications where consistent operation and integration density are priorities.

For engineering teams developing complex digital systems, this FPGA offers a balance of logic resources, on-chip memory, and I/O flexibility that supports scalable designs and streamlined board-level integration.

Request a quote or submit an inquiry to receive pricing and availability information for the XCAU25P-1FFVB676I.